A power commutation module includes a printed circuit board, a first plate-shaped bus bar, and a first plurality of power switches each including a plurality of connection pins which are connected on the upper face of the printed circuit board and a metal base plate which is applied against the bus bar. The first plurality of power switches is mounted on the first bus bar. The power switches are generally aligned along a longitudinal edge of the first bus bar, in that said longitudinal edge of the first bus bar is arranged along a first longitudinal edge of the printed circuit board, and the portion of the first bus bar on which the power switches are mounted is arranged next to the printed circuit board.

A magnetic device comprising a magnetic body, a coil disposed in the magnetic body and at least one thermal conductive layer, wherein a first portion of the at least one thermal conductive layer encapsulates at least one portion of the coil and a second portion of the at least one thermal conductive layer is exposed from the magnetic body, wherein the at least one thermal conductive layer forms a continuous thermal conductive path from the coil to the outside of the magnetic body for dissipating heat generated from the coil.

Example embodiments relate to electronic packages and electronic devices that include the same. One embodiment includes an electronic package. The electronic package includes a package body. The electronic package also includes a heat-conducting substrate arranged inside the package body and having a bottom surface that is exposed to an outside of the package body. Additionally, the electronic package includes an electronic circuit arranged inside the package body and including a semiconductor die that has a bottom surface with which it is mounted to the heat-conducting substrate and an opposing upper surface. Further, the electronic package includes one or more leads partially extending from outside the package body to inside the package body and over the minimum bounding box, each lead having a first end that is arranged inside the package body. In addition, the electronic package includes one or more bondwires for connecting the first end(s) to the electronic circuit.

Systems, articles, and methods for surface electromyography (“EMG”) sensors that combine elements from traditional capacitive and resistive EMG sensors are described. For example, capacitive EMG sensors that are adapted to resistively couple to a user's skin are described. Resistive coupling between a sensor electrode and the user's skin is galvanically isolated from the sensor circuitry by a discrete component capacitor included downstream from the sensor electrode. The combination of a resistively coupled electrode and a discrete component capacitor provides the respective benefits of traditional resistive and capacitive (respectively) EMG sensor designs while mitigating respective drawbacks of each approach. A wearable EMG device that provides a component of a human-electronics interface and incorporates such capacitive EMG sensors is also described.

An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.

Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.

A circuit board includes an electrically insulating part and an electrically conductive part. At least one semiconductor chip is embedded into the electrically insulating part in a part of the circuit board. Through openings in the part of the circuit board provide for passage of a cooling liquid. The through openings extend from a first surface of the circuit board to a second surface of the circuit board. The electrically conductive part includes a first outer conductive layer on the first surface and a second outer conductive layer on the second surface. The electrically conductive part also includes a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the part of the circuit board.

The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

Disclosed herein is a switching board having switching elements for temperature measurement mounted on a printed circuit board (PCB) having a circuit electrically connected to a unit cell constituting a battery module, the switching board including an upper board having a pair of switching elements, a temperature detection element, and one or more vertical through holes, the switching elements being electrically connected to the circuit, the temperature detection element and the vertical through holes being disposed between the switching elements, and a lower board having a heating pad at a position corresponding to the vertical through holes and the temperature detection element.

A voltage regulator module includes a first circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board, a plurality of switch elements and a first molding compound layer. The switch elements are mounted on a first surface of the first printed circuit board. The first molding compound layer is formed on the first surface of the first printed circuit board to encapsulate the switch elements. The magnetic core assembly is arranged beside a second surface of the first printed circuit board, and includes a magnetic core portion and at least one first U-shaped copper structure. The magnetic core portion includes a plurality of openings. Each first U-shaped copper structure is penetrated through two corresponding openings to define two inductors. A first terminal of each inductor and the corresponding switch element are connected in series to define a phase circuit.