A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.

A semiconductor package includes a metal baseplate having a die attach region and a peripheral region, a transistor die having a reference terminal attached to the die attach region and an RF terminal facing away from the baseplate, and a multilayer circuit board having a first side attached to the peripheral region and a second side facing away from the baseplate. The multilayer circuit board includes two embedded electrically conductive layers that are separated from the first and second sides by layers of composite fiber, and an embedded dielectric layer disposed between the two embedded electrically conductive layers. The embedded dielectric layer has a higher dielectric constant than the layers of composite fiber.

There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.

It is presented an inverter type motor drive device for feeding three phase AC electric power to an electric motor, the inverter type motor drive device comprising: an insulated metal substrate board on which, for each of the three phases, a plurality of power switches are mounted in straight lines in switch assemblies along a first direction; a printed circuit board on which a plurality of capacitors are mounted; and two DC power input terminals. The inverter type motor drive device further comprises three AC power output terminals, each extending through the printed circuit board while avoiding galvanic contact with the printed circuit board, and each of the three AC power output terminals comprise an elongated AC busbar, wherein a longitudinal direction of the AC busbar extends along the first direction.

A power module (100) arranged to receive an input voltage and to deliver an output voltage, comprising a supporting layer (110) with first and second main surfaces (111, 109) and a rim (122) surrounding the main surfaces. The power module (100) also comprises at least one component (112, 113, 114, 115) on or in the supporting layer (110) which protrudes a first perpendicular distance (d.sub.1) from one of the main surfaces. The power module (100) additionally comprises connectors (116-119; 120-123) for attaching the power module (100) to an external component (10). The one or more connectors (116-119; 120-123) protrude a second distance (d.sub.2) from said rim (122) in a perpendicular direction from one of the main surfaces (111, 109), so that the at least one component is at a predefined distance (d.sub.4, d.sub.5) from the external component (10) when the power module is attached to the external component (10).

An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a second transistor encased in a second package, the second transistor being mounted over a second conductive portion of the second package. The component further includes a substrate comprising an insulating layer between a first metal layer and a second metal layer. The first package is on one side of the substrate with the first conductive portion being electrically connected to the first metal layer, and the second package is on another side of the substrate with the second conductive portion being electrically connected to the second metal layer. The first package is opposite the second package, with at least 50% of a first area of the first conductive portion being opposite a second area of the second conductive portion.

According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress buffer. The component may be disposed on the flexible substrate and having a lateral surface. The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component.

A power module includes: a plurality of partition wall plates that are provided in a case and form a trench; a plurality of relay terminals whose electric potentials are different, that are formed so that the plurality of partition wall plates are positioned therebetween and that are formed to be opposed with each other; a printed circuit board to which the plurality of relay terminals is connected and which is provided with a slit at a position opposing the trench; and a shielding plate that is placed so that one end portion of the shielding plate is positioned in the trench, and so that an amount by which the other end portion thereof protrudes from the slit is larger than amounts by which the relay terminals protrude from the printed circuit board. The power module ensures insulation inside the power module.

A power conversion device includes a multilayer board including conductive layers that form a primary-side coil and a secondary-side coil of a transformer; and a circuit board electrically connected to the multilayer board, having a first conversion circuit formed therein or thereon. The multilayer board includes a transformer region in which the transformer is formed; a core member disposed in the transformer region and around the primary-side coil and secondary-side coil are wound; a circuit formed region which is adjacent to the transformer region and a second conversion circuit is formed, the second conversion circuit being electrically connected to the primary-side coil or the secondary-side coil; and a terminal portion which is electrically connected to the secondary-side coil or the primary-side coil. The first conversion circuit is electrically connected to the transformer via the terminal portion. One of the coils has a smaller number of turns than the other coil.

The disclosure relates to a communication technique and system after 4G systems for combining a 5G communication system with IoT technology to support higher data rates. Based on 5G communication and IoT-related technologies, the disclosure can be applied to intelligent services (e.g., smart home, smart building, smart city, smart or connected car, healthcare, digital education, retail, security, and safety). A converter may include: a first printed circuit board having a first controller for power conversion disposed on an inner surface of the first printed circuit board, the inner surface of the first printed circuit board comprised in an inner surface of the converter; a second printed circuit board having a second controller for power conversion disposed on an inner surface of the second printed circuit board, the inner surface of the second printed circuit board facing the inner surface of the first printed circuit board and comprised in the inner surface of the converter; first connectors disposed on the inner surface of the first printed circuit board; and second connectors disposed on the inner surface of the second printed circuit board, the second connectors configured to be coupled with the first connectors.