Provided is a high voltage bridge rectifier. The high voltage bridge rectifier includes a supporter, a substrate on the supporter, a plurality of equivalent diode circuits mounted on the substrate, interconnection lines, and terminals. The substrate may include an insulation layer, element pads disposed on a center of the insulation layer, and terminal pads disposed on an edge of the insulation layer to surround the element pads.

An optical module includes a conductor plate including a first through hole, a signal lead terminal fixed to the first through hole, and a wiring circuit board. The wiring circuit board includes a signal strip conductor member and a land on a first surface and a ground conductor layer and a second through hole on a second surface, the land surrounds the second through hole and is in contact with the signal strip conductor member, the signal lead terminal and the land are physically connected to each other through a solder and thus the signal lead terminal and the signal strip conductor member are electrically connected to each other, and at least a part of the land spreads outwardly, in a plan view, from not only a portion in contact with the signal strip conductor member but also an outer edge of the first through hole.

A switching device for low or medium voltage electric power distribution networks, the switching device comprising: at least an electric pole comprising a movable contact and a fixed contact, which are coupleable/decoupleable one to another; a circuit assembly, which comprises a chain of semiconductor devices adapted to switch in an ON state or in an OFF state depending on the voltage applied thereto, the semiconductor devices being electrically connected in series one to another in such a way that a current can flow according to a predefined conduction direction (CD) when the semiconductor devices are in an ON state. The circuit assembly comprises an input terminal, an output terminal and at least an intermediate terminal electrically connected with at least an intermediate electric node positioned between two subsequent semiconductor devices. The input terminal is electrically connected with the fixed contact: the input terminal, the output terminal and the at least an intermediate terminal are electrically coupleable/decoupleable with/from the movable contact when the movable contact reaches different positions during a movement towards/away from the fixed contact in such a way that different groups of semiconductor devices switch in an ON state or in an OFF state at different instants during the movement of the movable contact, depending on the position reached by the movable contact.

An intelligent power module and a manufacturing method thereof are provided. The intelligent power module includes a radiator, an insulating layer, a circuit wiring, a circuit component and a metal wire. At least part of a lower surface of the radiator is defined as a heat dissipating area, the heat dissipating area is provided with a heat dissipating corrugation, the insulating layer is provided to an upper surface of the radiator, the circuit wiring is provided to the insulating layer, and the circuit component is provided to the circuit wiring and is connected to the circuit wiring via the metal wire.

A converter module includes: a system board; and an isolated rectifier unit connected with the system board via at least one pin, the isolated rectifier unit including: a system board; a circuit module; and an isolated rectifier unit arranged adjacent to the circuit module and connected with the system board; wherein the isolated rectifier unit includes: a magnetic core comprising at least one core column parallel to the system board and two cover plates provided at both ends of the core column; and multiple carrier board units provided between the two cover plates and perpendicular to the system board, wherein each of the carrier board units comprises at least one via hole, at least one primary winding, at least one secondary winding and at least one switch connected with the at least one secondary winding.

A DC link bus includes a first and second set of conductive layers, arranged between insulation layers that separate the first set from the second set. A set of positive and negative link conductors are coupled normal to a respective set of conductive layers, and coupled together to define a respective positive bus and a negative bus. Additionally, a method of forming a DC link bus includes respectively coupling a first and a second set of parallel conductive layers to each other. Coupling a set of positive link connectors, and a set of negative link connectors, perpendicular to the first set and second set of layers, respectively, and to each other to define a positive bus and a negative bus. Interdigitally arranging the first and second set of conductive layers, spacing adjacent layers of the second set of layers to reduce an inductance between the positive and negative bus.

A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.

According to one or more embodiments of the present disclosure, a pill detection apparatus may comprise a blister pack receiving container, an elastomeric connector layer; and a printed circuit board (PCB) layer disposed beneath the elastomeric connector layer. The PCB layer may include a plurality of touch points, wherein each touch point of the plurality of touch points is configured to, when the blister pack is disposed on top of the elastomeric connector layer, sense whether a respective region of the blister pack is in contact with the elastomeric connector layer. The PCB layer may include a plurality of IR sensors sense properties of a respective region of the blister pack.

A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.

Disclosed is a printed circuit board including an overvoltage controlling element and an electronic device including the same. The printed circuit board includes a first outer layer, a second outer layer, at least one inner layer stacked between the first and second outer layers, an overvoltage controlling element comprising overvoltage controlling circuitry mounted on the first outer layer and including a plurality of terminals of which a first terminal is connected to a ground, and a conductive area configured to transfer at least a part of a first voltage applied from an external power source to an external IC and to transfer a remaining part of the first voltage to the overvoltage controlling element.