Electrical power for an electrical device can be acoustically produced. A first portion of an acoustic energy can be received at a piezoelectric transducer. A first electrical energy, produced from the first portion of the acoustic energy, can be conveyed from the piezoelectric transducer and received by a circuit. A bias voltage, produced from the first electrical energy, can be conveyed from the circuit and received at a capacitive transducer. A second portion of the acoustic energy can be received at the capacitive transducer. A second electrical energy, produced from the second portion of the acoustic energy, can be conveyed from the capacitive transducer and used as the electrical power for the electrical device. A ratio of the second electrical energy to the second portion of the acoustic energy can be greater than a ratio of the first electrical energy to the first portion of the acoustic energy.

An illumination system includes a green light source, a red light source, a blue light source, a first splitter, a second splitter, and a thermoelectric cooler. The first splitter is disposed downstream of the light sources, the first splitter being capable of reflecting a first color light beam and allowing a second color light beam to pass. The second splitter is disposed at the light paths of the light sources, and the second splitter being capable of reflecting a third color light beam and allowing the first color light beam and the second color light beam to pass, wherein the color of the first color light beam, the second color light beam, and the third color light beam are substantially different. The thermoelectric cooler is thermally coupled to the red light source, and neither the green light source nor the blue light source is thermally couple to any thermoelectric cooler.

According to one embodiment of the present invention, an electronic substrate includes a base including a first surface and a second surface that is a surface opposite to the first surface, an electronic component disposed on the second surface of the base, and a line disposed on the second surface of the base and connected to the electronic component, wherein the base includes a frame region including a flexible material and a plurality of opening regions passing between the first surface and the second surface, and the electronic component and the line are disposed in the frame region.

A biostimulator, such as a leadless cardiac pacemaker, having a flexible circuit assembly, is described. The flexible circuit assembly is contained within an electronics compartment between a battery, a housing, and a header assembly of the biostimulator. The flexible circuit assembly includes a flexible substrate that folds into a stacked configuration in which an electrical connector and an electronic component of the flexible circuit assembly are enfolded by the flexible substrate. An aperture is located in a fold region of the flexible substrate to allow a feedthrough pin of the header assembly to pass through the folded structure into electrical contact with the electrical connector. The electronic component can be a processor to control delivery of a pacing impulse through the feedthrough pin to a pacing tip. Other embodiments are also described and claimed.

A data diode chip provides a flexible device for collecting data from a data source and transmitting the data to a data destination using one-way data transmission. On-chip processing elements allow the data diode to identify automatically the type of connectivity provided to the data diode and configure the data diode to handle the identified type of connectivity.

An electronic component includes a first functional element including a pair of first connecting electrode portions formed on a first mounting surface, a pair of pillar electrodes connected to the corresponding first connecting electrode portions, a second functional element that includes a pair of second connecting electrode portions formed on a second mounting surface and that is arranged in a space defined by the first mounting surface of the first functional element and the pair of pillar electrodes, a pair of pad electrodes connected to the corresponding second connecting electrode portions, and a sealing resin that seals the pair of pillar electrodes, the pair of pad electrodes and the second functional element so as to expose the first lower surfaces of the pair of pillar electrodes and the second lower surfaces of the pair of pad electrodes.

The method comprises the steps of 1) producing first and second blanks (EB1, EB2) by laminating insulating and conductive inner layers (PP, CP, E1) on copper plates forming a base (MB1, MB2), at least one electronic chip (MT, MD) being sandwiched between the blanks, said blanks being produced such that their upper lamination surfaces have matching profiles, 2) stacking and fitting the blanks via their matching profiles, and 3) press-fitting the blanks to form a laminated sub-assembly for an integrated power electronics device. The method uses IMS-type techniques.

A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to 500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is 15 m.

Examples are disclosed that relate to electronically functional yarns. One example provides an electronically functional yarn comprising a core, a sheath at least partially surrounding the core, and an electronic circuit formed on the core. The circuit includes three or more control lines and more than three diode-containing circuit elements controllable by the three or more control lines, each circuit element being controllable via a corresponding set of two of the three or more control lines.

An adapter for electrically connecting a laser diode to a circuit board is disclosed. An example laser diode may form part of an optical communications system in which the laser diode emits optical signals into an optical fiber cable based on electrical signals received from one or more source circuits. The laser diode is electrically connected to the source circuit(s) through a circuit board. A laser diode adapter is provided to facilitate electrically connecting, as well as mechanically coupling, the laser diode to the circuit board. In this regard, the laser diode adapter includes conductive pads for coupling to conductive legs of the laser diode. The laser diode adapter also includes a set of conductive signal pads for coupling to conductive receiving pads which are electrically connected to the conductive pads, thereby electrically connecting the conductive legs of the laser diode to the circuit board.