An electronic module is provided including power switches mounted on a circuit board and configured as an inverter circuit for an electric motor. A sliding member is coupled to an actuator. A power contact switch is provided including a first conductive body, a second conductive body, and a contact switch. The first and second conductive bodies are mounted on a first surface of the circuit board and include pins received through through-holes of the circuit board to make electrical contact with two conductive tracks on a second surface of the circuit board. The contact switch pivotably is secured to the first conductive body and pivotably moveable by the sliding member to make contact with the second conductive body with movement of the actuator. A flyback diode is electrically connected between the first and second conductive track on the second surface of the circuit board parallel to the power contact switch.

In one embodiment, the substrate is configured for a semiconductor laser diode and comprises a plurality of substrate layers. The substrate layers include insulating layers and carrier layers, which are thicker. A plurality of electrical contact surfaces, which are configured for the semiconductor laser diode, a laser capacitor and a control chip, are located on an assembling side of a first, uppermost substrate layer, which is an insulating layer. Electrical conductor tracks, which electrically interconnect the contact surfaces, are located on the one hand between the first insulating layer and a second insulating layer, and on the other hand between the second insulating layer and a third substrate layer, which is preferably an insulating layer.

An electronic device is provided, the electronic device includes a driving substrate (13), the driving substrate includes a plurality of circular grooves and a plurality of rectangular grooves, and a plurality of disc-shaped electronic components, at least one disc-shaped electronic component is disposed in at least one circular groove, an alignment element positioned on a top surface of the at least one disc-shaped electronic component, a diameter of the at least one disc-shaped electronic component is defined as R, a diameter of the alignment element is defined as r, a width of at least one rectangular groove among the rectangular grooves is defined as w, and a height of the at least one rectangular groove is defined as H, and the disc-shaped electronic component and the rectangular groove satisfy the condition of (R+r)/2>(w.sup.2+H.sup.2).sup.1/2.

According to one embodiment, an electronic device includes a flexible film-like insulating base and a sensor disposed on the insulating base, and the insulating base includes a detection area in which the sensor is disposed and a peripheral area on an outer side of the detection area, and the peripheral area includes a reinforcement member provided thereon to extend along an outer circumference of the insulating base.

An ESD protection device includes a first terminal and a second terminal defining a first balanced port, a third terminal and a fourth terminal defining a second balanced port, and a ground terminal. A first coil and a third coil are provided between the first terminal and the third terminal to cancel an inductance component of a first ESD protection circuit. A second coil and a fourth coil are provided between the second terminal and the fourth terminal to cancel an inductance component of a second ESD protection circuit.

A device includes a printed circuit board assembly having a printed circuit board and one or more electronic components disposed on the printed circuit board, and a nanofilm disposed on the printed circuit board assembly. The nanofilm includes an inner coating in contact with the printed circuit board assembly, the inner coating including metal oxide nanoparticles having a particle diameter in a range of 5 nm to 100 nm; and an outer coating in contact with the inner coating, the outer coating including silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

A power supply unit includes: a power supply configured to discharge power to a load for generating an aerosol from an aerosol generation source; a charger configured to convert inputted power into charging power; a temperature measuring unit configured to measure a temperature of the power supply; and a charging controller configured to perform a first control for stopping the charger from supplying the charging power to the power supply and a second control for causing the charger to supply the charging power to the power supply, the charging controller setting a duty ratio to a value greater than 0 and smaller than 100 in a case where the temperature of the power supply is within a predetermined range, and the duty ratio being obtained by dividing a time during which the charging controller performs the first control by a unit time.

An embedded magnetic component transformer device includes primary, secondary, and auxiliary windings that are defined by conductive vias connected by conductive traces. The conductive traces and vias of the auxiliary winding are arranged between the conductive traces and vias of respective first and second portions of the primary winding, so that the auxiliary winding is provided substantially in the center of the width of the PCB. Power connections are provided at respective opposing edges of the device, and surface mounted transistors are provided close to the primary winding portions between the auxiliary winding and the edge of the device. The device provides an efficient utilization of the surface conductive traces such that large areas of the surface remain for other functions, such as ground plates. The thermal properties of the device are balanced by distributing the transistors and the power connections.

A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.

An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.