An electronic component includes a first functional element including a pair of first connecting electrode portions formed on a first mounting surface, a pair of pillar electrodes connected to the corresponding first connecting electrode portions, a second functional element that includes a pair of second connecting electrode portions formed on a second mounting surface and that is arranged in a space defined by the first mounting surface of the first functional element and the pair of pillar electrodes, a pair of pad electrodes connected to the corresponding second connecting electrode portions, and a sealing resin that seals the pair of pillar electrodes, the pair of pad electrodes and the second functional element so as to expose the first lower surfaces of the pair of pillar electrodes and the second lower surfaces of the pair of pad electrodes.

The invention concerns a device for controlling at least one diode 2, the control device comprising an electrical card 4 comprising a printed circuit 5 on which the following are mounted: a diode 2, a front component 7 and a storage capacitor 9 connected in such a way as to form a circuit loop 17 extending substantially in a thickness of the electrical card 4.

A biostimulator, such as a leadless cardiac pacemaker, having a flexible circuit assembly, is described. The flexible circuit assembly is contained within an electronics compartment between a battery, a housing, and a header assembly of the biostimulator. The flexible circuit assembly includes a flexible substrate that folds into a stacked configuration in which an electrical connector and an electronic component of the flexible circuit assembly are enfolded by the flexible substrate. An aperture is located in a fold region of the flexible substrate to allow a feedthrough pin of the header assembly to pass through the folded structure into electrical contact with the electrical connector. The electronic component can be a processor to control delivery of a pacing impulse through the feedthrough pin to a pacing tip. Other embodiments are also described and claimed.

Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing a first package including a first molded package body having a sidewall. A first leadframe is embedded within the first molded package body and having a first leadframe lead exposed through the sidewall. In certain implementations, a semiconductor die may also be encapsulated within the first molded package body. A Surface Mount Device (SMD) is mounted to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead exposed through the sidewall.

A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ≦500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ≦15 μm.

A data transmission circuit board, a mobile industry processor interface and a device are provided. The data transmission circuit board includes: a wiring substrate; a plurality of data transmission line pairs on one side of the wiring substrate; and a plurality of transient voltage suppression diodes on the one side of the wiring substrate. Data transmission lines of the data transmission line pairs are coupled to the transient voltage suppression diodes in a one-to-one correspondence, the line width of at least one data transmission line is within a line width threshold range; and the transient voltage suppression diode is configured to discharge when a voltage to ground on the corresponding data transmission line is greater than a discharge voltage threshold, wherein the discharge voltage threshold is not less than a maximum voltage value of the differential signal transmitted on the data transmission line.

A semiconductor apparatus includes a metal body in which a through hole is formed, a socket that covers the metal body without closing the through hole, a connection terminal connected to the metal body and exposed to an outside of the socket, a control board having a metal pattern and a circuit pattern, and a semiconductor chip having a control terminal connected to the circuit pattern via the through hole without being in contact with the metal body, the connection terminal being connected to the metal pattern.

A power supply unit for an aerosol inhaler includes: a case; a power supply that discharges power to a load for generating an aerosol from an aerosol generation source; a discharging terminal that connects the load to the power supply; a charging terminal that connects the power supply to an external power supply and is separated from the discharging terminal; a temperature measuring unit that measures temperature of the power supply; and a control device that controls an effective value of a first charging current to a value smaller than an effective value of a second charging current. The first charging current is supplied to the power supply when a measurement value of the temperature measuring unit is equal to or higher than a first threshold and the second charging current is supplied to the power supply when the measurement value is lower than the first threshold.

A substrate module includes: a substrate having top and bottom surfaces and comprising, at the top surface, a plurality of first wiring regions and a plurality of second wiring regions that are electrically connected to the plurality of first wiring regions; one or more power receiving devices disposed on the plurality of first wiring regions; a first connection component disposed on the plurality of second wiring regions, wherein the first connection component has opposite ends in a first direction; and a protected component disposed on the top surface of the substrate. In a top plan view, (i) the protected component is located between two straight lines passing through the respective opposite ends of the first connection component and extending in a second direction perpendicular to the first direction, and (ii) the protected component is located between the one or more power receiving devices and the first connection component.

A bi-directional solid state switch includes: a first bus bar; a second bus bar; a first solid state switch implemented on a first printed circuit board (PCB), the first solid state switch including: a first control terminal; a first terminal electrically connected to the first bus bar; and a second terminal; and a second solid state switch implemented on a second PCB, the second solid state switch including: a second control terminal; a third terminal electrically connected to the second terminal of the first solid state switch; and a fourth terminal electrically connected to the second bus bar.