Patent classifications
H05K2201/10189
Modular motherboard for a computer system and method thereof
One feature pertains to a modular design of a motherboard for a computer system. The mother board is disaggregated into a CPU board and an IO board. The CPU board contains at least one CPU, the associated memory subsystem and the voltage regulator module. The integrated IO ports escape to a high speed connector mating with its counterpart on an IO board which contains all peripheral devices including system logic not part of the CPU. In a multi-socket configuration the CPUs are on the CPU board and the processor interconnects are routed directly in a point to point manner.
Electric-power conversion apparatus
In the case where as a communication means among two or more control circuit boards corresponding to an on-vehicle environment, a wire harness is mounted, space-saving efficiency and assembly efficiency pose problems. When a board-to-board connector is utilized, arrangement of the control circuit boards cannot freely be performed, due to restriction of predetermined specific dimensions. An electric-power conversion apparatus includes a cooling device having a first surface, a second surface opposite to the first surface, and a hole penetrating the first surface and the second surface, a first control circuit board provided at the first surface side, a second control circuit board provided at the second surface side, and a pin header having a mold portion that partially wraps a connection pin penetrating the hole so as to connect the first control circuit board with the second control circuit board and that is fixed to the cooling device.
DOUBLE STUB TRANSMISSION LINE FOR SUPPRESSION OF HARMONICS
One aspect provides a printed circuit board (PCB). The PCB includes a transmission line to transmit signals of a desired frequency, a first stub coupled to the transmission line at a first location, and a second stub coupled to the transmission line at a second location. The first stub is to filter out signals of a first frequency, the second stub is to filter out signals of a second frequency, and the first and second stubs are positioned such that an insertion loss of the transmitted signals of the desired frequency is substantially minimized.
TRACE DESIGN TO REDUCE THE CONNECTOR CROSSTALK
Examples described herein relate to a system that includes: a circuit board comprising a plurality of layers, first and second conductive connections, first and second trace portions, first, second, and third routings, and a via wherein: the first conductive connection is coupled to the first trace portion, the second conductive connection is coupled to the second trace portion, the first routing is formed in a first layer of the plurality of layers, the second routing is formed in a second layer of the plurality of layers, the third routing is formed in the first layer of the plurality of layers, a portion of the first routing overlaps with a portion of the second routing to provide a capacitive region, and the via conductively couples a portion of the second routing overlaps with a portion of the third routing.
Vital relay assembly for modular solid-state current-limiting
A relay assembly comprises a vital relay used in a vital circuit and configured to be rack-installed in an equipment room in a railroad case or a railroad housing for providing a modular solid-state current-limiting. The relay assembly further comprises a plurality of vital relay contacts to which a current flow is restricted by a single supply solid-state current limiter. The relay assembly further comprises a relay socket base assembly coupled to the vital relay. The relay socket base assembly includes a relay socket base including a plurality of vital relay contact prongs, a plug assembly including a plurality of printed circuit board (PCB) mounted contact terminals, and a plurality of contact terminals that provide a connection between the plurality of vital relay contact prongs and the plurality of printed circuit board (PCB) mounted contact terminals. The relay assembly further comprises an ancillary electrical control module.
Strap connector
A strap connector includes an insulating body, a conductive element, a locking member, a pressing block, and a strap connected with the pressing block. The locking member includes a main body portion and a locking elastic arm. The main body portion includes a top plate. The locking elastic arm extends from the top plate and is used for locking with a mating connector. The pressing block is slidable backwardly under the pulling of the strap, so that the pressing block presses the top plate downwardly, and then the locking elastic arm moves downwardly to realize unlocking. When the unlocking method disclosed in the present disclosure is performed, it is only necessary to ensure that the pressing block slides over the top plate, which improves the reliability of unlocking.
Fastening system for single or multiple electronic device installations
Electronic device fastening systems that enable one or more electronic devices to be reliably and quickly secured on a host board and electronic systems made of the same. In a specific exemplary embodiment, a retainer clip spans across the width of one or more electronic devices, engages with the board and snaps into place. The clip includes one or retaining posts such that when the clip engages the board, the one or more retaining posts align and engage with a predefined mounting feature of a corresponding one of the one or more electronic devices, thereby securing the electronic device in place to restrict horizontal, lateral, and vertical movement of the electronic device.
Signal transmission circuit and printed circuit board
A signal transmission circuit includes a printed circuit board including a surface layer including a signal transmission path that transmits a signal, a signal line through hole that connects the signal transmission path with a signal layer arranged in an inner layer of the printed circuit board, a ground layer of the inner layer of the printed circuit board that forms a return current transmission path for the signal transmission path, and a ground through hole that is connected to the ground layer adjacent to the signal line through hole. A ground pattern including ground areas disposed with a certain distance therebetween and a side ground area connected with at least one end side of the ground areas is disposed at positions of both sides of the signal transmission path. The ground through hole is disposed to connect the ground pattern with the ground layer.
HEAT TRANSFER MEMBER-EQUIPPED SUBSTRATE AND METHOD FOR MANUFACTURING HEAT TRANSFER MEMBER-EQUIPPED SUBSTATE
A heat transfer member-equipped substrate includes a heat transfer member installed in a through hole of a substrate; a heat generating component; and a solder portion soldering the heat generating component to the heat transfer member, a nickel base plating formed on the heat transfer member, and the solder portion bonded to the nickel base plating where a gold plating that suppresses oxidization of the nickel base plating is blended into the solder portion. The heat transfer member includes a first and a second heat transfer portion bonded to each other, the first heat transfer portion made of a first metal, the second heat transfer portion made of a second metal formed on at least a portion of a surface of the second heat transfer portion, and the second heat transfer portion being a plate shape that protrudes from a circumference of the first heat transfer portion.
Flexible Printed Circuit Board and Display Touch Apparatus
A flexible printed circuit board and a display touch apparatus are provided. The flexible printed circuit board includes a binding terminal region, a first circuit region and a second circuit region; the binding terminal region includes multiple terminals, the first circuit region includes a driver circuit, multiple first signal lines, multiple second signal lines, and multiple third signal lines, and the second circuit region includes an external connector; first ends of the multiple first signal lines, the multiple second signal lines and the multiple third signal lines are respectively connected to the terminals of the binding terminal region; second ends of the multiple first signal lines and the multiple second signal lines are respectively connected to the driver circuit; and second ends of the multiple third signal lines are connected to the connector.