An electronic device includes an antenna module including an antenna array, a radio frequency integrated circuit (RFIC) connected with the antenna array and a flexible printed circuit board connected with the RFIC, a connector disposed on the flexible printed circuit board, a communication processor disposed on a first printed circuit board, a coaxial cable electrically connecting the flexible printed circuit board and the communication processor through the connector, and a second printed circuit board configured to electrically connect the communication processor and the flexible printed circuit board. The communication processor provides a data signal to be transmitted to an external electronic device to the RFIC along a first path in the flexible printed circuit board through the coaxial cable and the connector, and provide a control signal to the RFIC along a second path in the flexible printed circuit board through the second printed circuit board.

According to one embodiment, an electronic device includes: a housing; a first electronic component inside the housing; a second electronic component arranged inside the housing and spaced apart from the first electronic component; a female connector electrically connected to the second electronic component, the female connector comprising multiple conductive pins; a male connector electrically connected to the first electronic component and configured to contact at least some of the multiple conductive pins of the female connector, the male connector comprising a base film, a conductive layer formed on one surface of the base film, and an adhesive layer formed on the back surface of the base film, thereby forming a lamination structure; and multiple reinforcement members provided on at least one of one surface of the base film and the back surface thereof so as to form a peripheral portion of the lamination structure.

Provided is an electronic control unit capable of suppressing an increase in size of a board. An electronic control unit of the present invention includes a connector having a power supply terminal, a power supply board 12 (first board), and a control board 13 (second board). The power supply board includes an inner-layer copper foil 55 (inner-layer conductor), and a power conversion circuit that converts input power input via a power supply terminal into predetermined output power is mounted thereon. The control board 13 includes an inner-layer copper foil 55, and mounted with a control circuit is mounted thereon. In addition, a thickness of the inner-layer copper foil 55 of the power supply board 12 is thicker than a thickness of the inner-layer copper foil 55 of the control board 13.

A wiring device including a first printed circuit board (PCB) that includes a first direct current (DC) output port and a second DC output port. The wiring device further includes a second PCB electrically connected with the first PCB, the second PCB including a planar transformer integrated with a surface of the second PCB and configured to output power at one or more DC voltage levels, a switch connected to the planar transformer, and a microcontroller. The microcontroller includes an electronic processor and is configured to control delivery of power from the planar transformer to at least one of the first DC output port and the second DC output port using the switch. The switch may have a Gallium Nitride (GaN) chemistry or a Silicon Carbide (SiC) chemistry.

A memory module operation system for operating in high stress environments with strong vibration. The application and use of a retainer to reduce and dampen the effects of system vibration and the application of dynamic loads can retain a memory module in place in a memory socket. Further, the retainer can operate to reduce the effects of electromagnetic interference and can act as a heat transport system to reduce thermal stress on components.

An electronic control module, particularly for a transmission, includes a first circuit board element and a sensor unit carrier fastened to the first circuit board element. The sensor unit carrier has a sensor unit receptacle configured to receive a sensor unit. The sensor unit has a sensor element fastened and electrically connected to a second circuit board element so as to detect at least one measured value. The sensor unit is fastened in the sensor unit receptacle. The second circuit board element has a flexible region that separates a first sub-region of the second circuit board element from a second sub-region of the second circuit board element. The first sub-region has a predetermined angle to the second sub-region. The sensor element is electrically connected to the first circuit board element by the second sub-region of the second circuit board element.

An electronic device is provided. The electronic device includes a hinge structure, a first housing structure, a second housing structure that is foldable with the first housing structure, a foldable housing, a flexible display, a first mid-plate disposed on one side of the first housing structure, a second mid-plate disposed on one side of the second housing structure, a flexible printed circuit board (FPCB) extending between the first mid-plate and the second mid-plate, a first sealing member that seals a first opening formed in the first mid-plate, and a second sealing member that seals a second opening formed in the second mid-plate.

An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.

An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.

A connector is mounted on an input-output board. The connector is interposed between the input-output board and a CPU board, and thereby a plurality of pads of the input-output board and a plurality of pads of the CPU board are respectively electrically connected. The connector includes a rectangular flat-plate housing having a first positioning hole and a second positioning hole, and at least one contact row held on the housing. The first positioning hole is formed at a first housing corner part of the housing. The second positioning hole is formed at a fourth housing corner part, which is at a diagonal position with respect to the first housing corner part, of the housing.