Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. The at least one interconnect element is undetectable by x-ray, and the conductive lines are detectable by x-ray. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

A support part for an LCD display module of an electronic device includes at least one element for receiving a press device for pressing a dummy key. The support part at least one attachment element for securing the part to a printed circuit board of the electronic device such that the press device is compressed between the support part and the printed circuit board.

A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.

A PCB pad for a SMT process is combined on a PCB. The PCB pad includes an insulation body and a metal reflow portion disposed on the insulation body. The metal reflow portion is located on the side of the insulation body adjacent to the PCB. The metal reflow portion is not electrically connected with the PCB. Thus, the PCB pad may support electronic components of the PCB and prevent the electronic components from being damaged by an external pressure.

An example device includes a planar circuit board with a first surface and a second surface opposite the first surface, an electrical circuit on at least one of the first surface or the second surface, and at least one dummy electronic component mounted on the first surface. The electrical circuit includes at least one electronic component. The dummy electronic component is electrically isolated from the electrical circuit. The dummy electronic component has a protrusion from the planar circuit board that is greater than protrusion of each of the at least one electronic component of the electrical circuit.

An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

A circuit board to be mounted on a casing of a cartridge includes an insulating substrate, an integrated circuit mounted on the substrate, terminals and a dummy electrode. The terminals are electrically connected to the integrated circuit, while the dummy electrode is electrically disconnected from the integrated circuit. The terminals and dummy electrode are formed on the substrate to satisfy an inequity of L1+L2<L3, where L1 is a shortest distance among distances between edges of the terminals and an edge of the dummy electrode in a direction perpendicular to a predetermined direction in which the terminals are aligned with one another; L2 is a shortest distance between an edge of the dummy electrode and an edge of the casing in the predetermined direction; and L3 is a shortest distance among distances between edges of the terminals and the edge of the casing in the predetermined direction.