According to certain aspects, a circuit board panel includes a first module circuit board and a second module circuit board arranged to define a space that runs between a first portion of the periphery of the first module circuit board and a portion of the periphery of the second module circuit board; and a plurality of shield components each extending across the space and including a first conductive portion mounted along the first portion of the periphery of the first module circuit board, a second conductive portion mounted along the portion of the periphery of the second module circuit board, and a non-conductive portion extending between the first conductive portion and the second conductive portion, the first and second conductive portions of each of the plurality of shield components configured to provide electromagnetic shielding for at least one electronic component mounted on the first and second module circuit boards, respectively.

A printed circuit board and a printed circuit board includes a signal transmitting part; a ground part that includes an impedance adjusting part and a dummy part; and an insulating layer disposed between the signal transmitting part and the ground part.

According to one embodiment, an electronic device includes a circuit board and a circuit component on an upper surface or a lower surface of the circuit board. The circuit component includes a first ceramic capacitor and a second ceramic capacitor. Vibration characteristics of the first ceramic capacitor and a second ceramic capacitor are opposed to each other. The first ceramic capacitor is near the second ceramic capacitor to cause vibrations of the first and second ceramic capacitors to cancel each other.

A dummy memory board includes a substrate, a connecting finger, a plurality of light emitting diodes, and an electrical circuit. The substrate has a front surface and a back surface, and is provided with at least one dummy memory region. The connecting finger is close to a lower edge of the substrate for inserting into a memory slot. The light emitting diodes are on the substrate and close to the upper edge of the front surface and the back surface. The electrical circuit is on the substrate for connecting the light emitting diodes to the connecting finger. Thus, power from the memory slot is transferred to the light emitting diodes through the connecting finger, and the light emitting diodes are turned on to demonstrate the desired light effect. Particularly, the electrical circuit has no suspending node or open spot and interference due to antenna effect is avoided.

Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

The present invention discloses a fabrication method of thick-walled printed circuit board PCB), especially the packaging substrate for mounting thin wafer level components on the PCB substrate. The present invention provides a first embodiment of inserting a dummy at the circuit board manufacturing stage and a second embodiment of adjusting the thickness by inserting a dummy at the wafer processing stage.

The present disclosure provides semiconductor packages including dummy packages. In some embodiments, the semiconductor package includes a solid-state drive (SSD) device including a printed circuit board including a memory region, a plurality of memory packages disposed on the memory region, and at least one dummy package disposed on the memory region. The at least one dummy package is electrically coupled with the printed circuit board. The at least one dummy package includes a first pad constituting a heat path through which heat of the printed circuit board is dissipated.

A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.

In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.