An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

A semiconductor substrate includes: (1) a first dielectric structure having a first surface and a second surface opposite the first surface; (2) a second dielectric structure having a third surface and a fourth surface opposite the third surface, wherein the fourth surface faces the first surface, the second dielectric structure defining a through hole extending from the third surface to the fourth surface, wherein a cavity is defined by the through hole and the first dielectric structure; (3) a first patterned conductive layer, disposed on the first surface of the first dielectric structure; and (4) a second patterned conductive layer, disposed on and contacting the second surface of the first dielectric structure and including at least one conductive trace, wherein the first dielectric structure defines at least one opening, and a periphery of the opening corresponds to a periphery of the through hole of the second dielectric structure.

A method for manufacturing a circuit, in particular of a hearing aid, in which method a printed circuit board is made available with a first region and with a second region which are separated by means of a boundary. A component is mounted on the printed circuit board, wherein the component is positioned on the boundary. The first region is covered by means of a mask which has an edge, wherein the edge is positioned on the component, and the printed circuit board is provided with a coating. The coating is cut away in the region of the component and the mask is removed.

A device may include a printed circuit board (PCB), a plurality of surface-mount devices disposed on the PCB, wherein a thermal mass of each of the surface-mount devices ranges between a first thermal mass value and a second thermal mass value that is greater than the first thermal mass value, and a plurality of thermal capacitors disposed on the PCB, wherein a thermal mass of each of the thermal capacitors is equal to or greater than the first thermal mass value of the surface-mount devices.

A semiconductor substrate includes: 1) a first dielectric structure having a first surface and a second surface opposite the first surface; 2) a second dielectric structure having a third surface and a fourth surface opposite the third surface, wherein the fourth surface faces the first surface, the second dielectric structure defining a through hole extending from the third surface to the fourth surface, wherein a cavity is defined by the through hole and the first dielectric structure; 3) a first patterned conductive layer, disposed on the first surface of the first dielectric structure; and 4) a second patterned conductive layer, disposed on the second surface of the first dielectric structure and including at least one conductive trace. The first dielectric structure defines at least one opening to expose a portion of the second patterned conductive layer.

In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.

Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

A method of manufacturing a wiring substrate according to the present invention includes a step of forming a wiring layer including connection terminals on a first insulating layer; a step of forming a second insulating layer on the wiring layer and on the first insulating layer; a step of forming electrically insulative dummy portions separated from the wiring layer on the first insulating layer through patterning of the second insulating layer; a step of forming a third insulating layer on the wiring layer, on the dummy portions, and on the first insulating layer; and a step of forming openings in the third insulating layer for exposing the connection terminals in such a manner that upper end portions of the connection terminals protrude from the third insulating layer, and lower end portions of the connection terminals are embedded in the third insulating layer.

The present disclosure relates to a printed circuit board, including: a first insulating layer having a through-portion; a chip stack including a first chip having a rear surface opposite to a front surface on which a connection pad is disposed, and a second chip attached to the rear surface of the first chip and having a different thickness from the first chip, wherein at least a portion of the chip stack is disposed in the through-portion.; and a second insulating layer covering at least a portion of each of the first insulating layer and the chip stack and disposed in at least a portion of the through-portion.

A carrier substrate includes an insulation encapsulation, first conductive patterns, second conductive patterns, at least one first dummy pattern, and at least one second dummy pattern. The carrier substrate has a first layout region and a second layout region. The first conductive patterns and the first dummy pattern are located in the first layout region. The second conductive patterns and the second dummy pattern are located in the second layout region. The first and second conductive patterns and the first and second dummy patterns are embedded in the insulation encapsulation. The insulation encapsulation exposes top surfaces of the first and second conductive patterns and the first and second dummy patterns. The first dummy pattern and the second dummy pattern are insulated from the first conductive patterns and the second conductive patterns. An edge profile of the first dummy pattern facing the second dummy pattern is non-linear.