Provided is a glass circuit board and a manufacturing method thereof and an imaging device that achieve higher reliability. A glass circuit board including: a glass substrate serving as a core material including a first side, a second side located opposite from the first side, an outer end face located between the first side and the second side, and a through hole penetrating between the first side and the second side; an insulating first resin layer covering the first side; an insulating second resin layer covering the second side; a third resin layer that covers the inner surface of the through hole and is continuous with the first resin layer and the second resin layer; a fourth resin layer that covers the outer end face and is continuous with the first resin layer and the second resin layer; a first core wiring provided on the first side with the first resin layer interposed between the first core wiring and the first side; a second core wiring provided on the second side with the second resin layer interposed between the second core wiring and the second side; and a feed-through wiring provided on the inner surface of the through hole with the third resin layer interposed between the feed-through wiring and the inner surface.

A substrate support includes a top plate including a dielectric material and an outer dielectric surface configured to support a substrate, printed heater sealed within the top plate, and a printed electrostatic chuck (ESC) circuit sealed within the top plate. A printed wiring layer may also be sealed within the top plate. The printed heater includes a heater material printed on a first interior dielectric surface of the top plate. The printed ESC circuit includes an electrically conductive material printed on a second interior dielectric surface of the top plate. When included, the printed wiring layer may include wiring traces printed on a third interior dielectric surface of the top plate. A dielectric base layer with vias electrically coupling the wiring traces to the printed heater may be included between the printed wiring layer and the printed heater.

Disclosed are a semiconductor package device and a method of manufacturing the same. The semiconductor package device includes a circuit substrate unit including a plurality of conductive via elements extending in a vertical direction and a plurality of conductive pattern layer elements extending in a horizontal direction, a molding layer configured to form a single substrate shape along with the circuit substrate unit while filling the space around the circuit substrate unit, the molding layer being disposed so as to expose the circuit substrate unit, a redistribution layer member disposed on a first surface of a package substrate including the circuit substrate unit and the molding layer, and a plurality of chips mounted on the redistribution layer member so as to be electrically connected to the redistribution layer member.

An electronics assembly used in a vehicle included a printed circuit board (PCB) having a first side and a second side; a plurality of electrical components mounted on the first side of the PCB; a heat sink, configured to receive cooling fluid from a source, positioned adjacent to the second side of the PCB; and a cooling fluid conduit, configured to communicate the cooling fluid from a fluid inlet to a fluid outlet, wherein the cooling fluid conduit is positioned adjacent to the first side of the PCB and directly contacts an outer surface of the electrical components.

A printed circuit board includes a plurality of dielectric layers, a plurality of conductive pattern layers, a first through hole, a second through hole, and an inner layer via. The inner layer via penetrates through each dielectric layer from an Mth dielectric layer to the (N-1)th dielectric layer, where M is an integer that is greater than equal to two and less than or equal to (N-1) and has an inner circumferential surface on which an inner layer via conductor is disposed. At least a portion of the inner layer via is disposed in an inner via arrangement region. At least one of the first through hole and the second through hole is connected to the inner layer via with at least one conductive pattern layer that is selected from a second conductive pattern layer to an Nth conductive pattern layer in the plurality of conductive pattern layers.

A circuit board according to an embodiment includes an insulating layer; a pad disposed on the insulating layer; and a protective layer disposed on the insulating layer and including a recess portion vertically overlapping with the pad, wherein the protective layer includes a first portion including a first part of the recess portion; and a second portion disposed on the first portion and including a second part of the recess portion connected to the first portion, and wherein a width of the second part of the recess portion is greater than a width of the first part of the recess portion.

A semiconductor package according to an embodiment comprises an insulating layer; a pad part disposed on the insulating layer; a protective layer disposed on the insulating layer and including an open region overlapping the pad part in a vertical direction, wherein a width of the open region of the protective layer in a horizontal direction satisfies a range of 10 m to 30 m, and a surface roughness of an upper surface of the protective layer is different from a surface roughness of an inner surface of the open region of the protective layer.

A mainboard includes at least one power supply module and a mainboard body. The power supply module is arranged on the mainboard body. The power supply module comprises at least one surface-mounted element, a carrier plate, and an insulating layer. The carrier plate is provided with a first surface and a second surface which are opposite to each other, and the surface-mounted element is arranged on the first surface and the second surface. The insulating layer is formed in a chemical vapor deposition mode; a gap is formed between the surface-mounted element and the carrier plate, the gap is not completely filled with the insulating layer, and the insulating layer is further at least partially arranged on the surface of the space where the gap is located.

A loopback module includes a housing, a circuit board and a thermoelectric cooler. The circuit board is disposed in the housing. The circuit board includes a loopback circuit, a microcontroller, a temperature sensor and a thermoelectric cooler driver. The thermoelectric cooler is disposed in the housing. The thermoelectric cooler has a first side and a second side located at opposite sides, wherein the first side is in contact with the circuit board and the second side is in contact with the housing. One of the first side and the second side is a cold side and the other one of the first side and the second side is a hot side.

A circuit board according to an embodiment includes a first pad; an insulating layer disposed on the first pad; a second pad disposed on the insulating layer; and a through electrode formed in a through hole passing through the insulating layer and connecting the first pad and the second pad, wherein the through electrode includes a first metal layer formed on an inner wall of the through hole; and a second metal layer formed on the first metal layer and filling the through hole, the first pad is in contact with a lower surface of the through electrode and has a thickness in a range of 1.0 m to 12 m, and the second pad includes a third metal layer extending from the first metal layer; and a fourth metal layer extending from the second metal layer.