H05K2201/10212

Circuit Board Assembly, Display Panel and Display Device
20210161014 · 2021-05-27 ·

The present disclosure discloses a circuit board assembly, a display panel and a display device. The circuit board assembly includes a circuit board body, which includes a first side surface and a second side surface. The first side surface faces away from the second side surface, the first side surface defines a bonding area, the second side surface defines a mounting area, and the mounting area defines a mounting site for mounting a functional chip.

Multi-mode and/or multi-speed non-volatile memory (NVM) express (NVMe) over fabrics (NVMe-of) device

In an example, a device includes: a printed circuit board (PCB); at least one solid state drive (SSD) connected at a first side of the PCB via at least one SSD connector; at least one field programmable gate array (FPGA) mounted on the PCB at a second side of the PCB; and at least one connector attached to the PCB at a third side of the PCB, wherein the device is configured to operate in a first speed from a plurality of operating speeds based on a first input received via the at least one connector.

SpaceCube V3.0 single-board computer

A single-board computer system radiation hardened for space flight includes a printed circuit board (PCB) having a top side and bottom side; a reconfigurable field programmable gate array (FPGA) processor device a connector disposed on the top side; a plurality of peripheral components mounted on the bottom side, wherein AC coupling capacitors are configured to select routing between the first FPGA and the second FPGA. An expansion card plug attaches to a connector on the bottom of the PCB and a frame is mounted to the PCB.

Systems and methods for in-silicon measurement of printed circuit board (PCB) trace impedance
10999922 · 2021-05-04 · ·

Systems and methods that may be implemented to provide on-board trace impedance testing for a system level board of an information handling system. A printed circuit board (PCB) of the system level board may include built-in test trace circuitry that may be used to measure board trace impedance so that the trace impedance of a fully assembled system level board may be tested and verified for compliance with trace impedance specification, and without requiring any disassembly of the board.

Two component programmable modular system and method of using the same
10813428 · 2020-10-27 ·

The present invention is directed to programmable LED handbags/wearables that contain a custom PCB with RGB LEDs with optional sensors. These PCBs display customizable colors/patterns in response to modifiable computer code, signals from other programmable LED handbags/wearables, and/or the input from the surrounding environment. These PCBs are attached to the bag with detachable fasteners to they may be easily accessed for programming, or removed to be placed in a different wearable item. Detachable fasteners and positioning element provide alignment/prevent displacement between the orifices in the wearables and LEDs on the PCB.

Method of manufacturing a chip component

A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

Differential pair contact resistance asymmetry compensation system

A differential pair contact resistance asymmetry compensation system includes a differential trace pair that is provided on a board, a transmitter device that is coupled to the differential trace pair via a transmitter device connector interface, and a receiver device that is coupled to the differential trace pair via a receiver device connector interface. The receiver device receives, from the transmitter device via the differential trace pair, a contact resistance compensation data stream. The receiver device adjusts an impedance provided by the receiver device to compensate for a contact resistance asymmetry in at least the receiver device connector interface, and sets the impedance provided by the receiver device.

METHODS AND APPARATUS FOR PROGRAMMING AN INTEGRATED CIRCUIT USING A CONFIGURATION MEMORY MODULE
20200174959 · 2020-06-04 · ·

An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.

Dual dynamic random (DDR) access memory interface design for aerospace printed circuit boards

The present invention relates to a single board computer system with an improved memory and layout. The unique layout of the printed circuit board of the present invention allows for different parts to be placed in a back-to-back configuration to minimize the dimensions of the printed circuit board. This includes a high-performance radiation-hardened reconfigurable FPGA, for processing computation-intensive space systems, disposed on both sides of the printed circuit board. Four dual double data rate synchronous dynamic random-access memories (DDR2 SDRAMs) disposed on both the top side and on the bottom side of the printed circuit board reduce an operating voltage of said printed circuit board. A layout stack-up of the printed circuit board includes twenty-two symmetrical layers including ten ground layers, four power layers, six signal layers, a top layer, and a bottom layer.

Panel alignment device and panel alignment method for display device

A panel alignment device for a display device includes a stage supporting a panel and including a transmitting portion that includes a first region having a first thickness and a second region having a second thickness greater than the first thickness, a head disposed over the stage and supporting a driving chip, a vision camera which is disposed under the stage, captures a first alignment mark of the panel through the first region, and captures a second alignment mark of the driving chip through the second region, and a controller which controls at least one of a movement and a rotation of each of the stage and the head based on first image information related to a position of the first alignment mark and second image information related to a position of the second alignment mark.