[Problem] There is demand for chip resistors that are compact and that have high resistivity. [Solution] A chip resistor (100) has a substrate (11), a first connection electrode (12) and a second connection electrode (13) that are formed on the substrate (11), and a resistor network that is formed on the substrate (11) and that has ends one of which is connected to the first connection electrode (12) and the other one of which is connected to the second connection electrode (13). The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line (103) that is provided along inner wall surfaces of trenches (101). The resistive element film line (103) extending along the inner wall surfaces of the trenches (101) is long and has a high resistivity as a unit resistive element. [Effect] The resistivity of the chip resistor (100) as a whole can be increased.

Disclosed is a board including a semiconductor device including a first terminal to receive a signal that sets a functionality of the device, a second terminal to supply a first value and a third terminal to supply a second value, a first connection member connected to the first to third terminals of the semiconductor device, and a second connection member adapted to be connected to the first connection member provided on a counterpart board, with at least two terminals of the second connection member connected together via a first connection circuit, wherein the first connection member of the board is connected to the second connection member of another counterpart board.

A circuit board includes a platform controller hub (PCH), a peripheral component connector and a switch. The PCH includes a clock request pin and a GPIOB pin. The peripheral component connector includes a connector pin. The switch is controlled by the GPIOB pin and is coupled between a low potential and a line between the connector pin and the clock request pin and is configured to: conduct the line and the low potential based on a high potential of the GPIOB pin; and disconnect the line and the low potential based on the low potential of the GPIOB pin.

The present disclosure relates to a glass cloth, prepreg, and printed circuit board. There is provided a glass cloth including woven glass yarns, wherein a bulk dissipation factor of a glass in the glass yarns is 0.0010 or less, a bending rigidity (gf-cm/cm) per warp direction basis weight (g/m.sup.2) of the glass cloth is in the range of 0.0002 to 0.0014, and a dissipation factor of the glass cloth at 10 GHz is in the range of greater than 0 and 0.0010 or less.

To provide a thin film capacitor having a pair of terminal electrodes capable of being disposed on the same plane. A thin film capacitor includes a metal foil having a roughened surface, a dielectric film covering the roughened surface of the metal foil and having an opening partially exposing the metal foil therethrough, an electrode layer contacting the metal foil through the opening, and an electrode layer contacting the dielectric film without contacting the metal foil. An upper surface position of the electrode layer is equal to or lower in height than that of the electrode layer.

A wiring board according to the present disclosure includes a first insulation layer, a first laminate portion, a second laminate portion, a second insulation layer, a third insulation layer, a first mounting region, a second mounting region, a first electrical conductor layer having a planar shape, a second electrical conductor layer, and a solder resist having an opening from which a part of the first electrical conductor layer is exposed. In a plane perspective view, in a frame-shaped region between an outer peripheral edge of the first mounting region and an outer peripheral edge of the second mounting region, a through-hole conductor that connects the first electrical conductor layer and the second electrical conductor layer is located across the edge of the opening.

The present disclosure relates to a printed circuit board assembly including a first circuit board including a first footprint, the first circuit board further includes a plurality of first vertical vias extending between a first side and an opposing second side; a second circuit board including a second footprint smaller than the first footprint, the second circuit board further includes a plurality of second vertical vias extending between a subsequent first side and an opposing subsequent second side; an adhesive layer coupling the first side to the subsequent first side; and a plurality of third vertical vias extending through the first side and the subsequent first side.

A panel alignment device for a display device includes a stage supporting a panel and including a transmitting portion that includes a first region having a first thickness and a second region having a second thickness greater than the first thickness, a head disposed over the stage and supporting a driving chip, a vision camera which is disposed under the stage, captures a first alignment mark of the panel through the first region, and captures a second alignment mark of the driving chip through the second region, and a controller which controls at least one of a movement and a rotation of each of the stage and the head based on first image information related to a position of the first alignment mark and second image information related to a position of the second alignment mark.

A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a first electrode part disposed on the second insulating layer; a second electrode part disposed on the first electrode part; a second insulating layer disposed on the second electrode part; and a fourth insulating layer disposed on the third insulating layer, wherein an upper surface of the first insulating layer includes a plurality of first convex parts, wherein a lower surface of the fourth insulating layer includes a plurality of second convex parts, and wherein at least one of distances between adjacent first convex parts among the plurality of first convex parts includes a region different from at least one of distances between adjacent second convex parts among the plurality of second convex parts.

Provided is an electronic device capable of preventing noise from leaking from the opening of a circuit board shield. An IC chip is disposed at an opening of a circuit board shield, and a plurality of fixing portions formed in a shield plate of a heat dissipation device are disposed to surround the IC chip. At least one protruding contact portion is formed between two adjacent fixing portions. The heat dissipation device and the circuit board shield are in contact with each other through the fixing portions and the protruding contact portion.