A thermal chamber multiple sides that form an enclosed chamber. The thermal chamber includes a first side of the multiple sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber. The thermal chamber includes a second side of the multiple sides, the second side located opposite the first side and including one or more ports that expose the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.

A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.

A vaporizer includes a liquid storage configured to store a liquid composition, an aerosol generator coupled to one end of the liquid storage, and including a wick configured to absorb the liquid composition from the liquid storage, a liquid heater configured to generate aerosol by heating the wick, an aerosol chamber surrounding the wick and the liquid heater, an inlet through which external air is introduced into the aerosol chamber, and an outlet through which the aerosol generated in the aerosol chamber is discharged, and an air supplier configured to supply the external air to the aerosol generator, and including a first opening connected to the inlet of the aerosol generator and a second opening that is opposite to the first opening and connected to the outside at a position spaced apart from the first opening along a direction from the one end to another end of the liquid storage.

First event information that is associated with an event that corresponds to a temperature of a memory sub-system is received. Whether the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies a first threshold condition is determined. Responsive to determining that the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies the first threshold condition, a thermoelectric component (TEC) is caused to change from an inactive state to an active state by decreasing a temperature at a bottom surface of the TEC that is coupled to the memory sub-system as a temperature at a top surface of the TEC increases.

Soft motherboards having rigid plugin modules are described herein. In one aspect of the present disclosure, an electronic device can include a polymeric substrate having: a plurality of slots, each configured for receiving an electronic module; one or more electrical junctions including a stretchable conductive interconnect electronically coupling a slot to another slot of the plurality of slots; and at least one electronic module including: a film configured to: support other components of the electronic module; and be inserted, and be partially housed in, one of the plurality of slots of the polymeric substrate; and at least one electrode coupled to the film and positioned to be in contact with a corresponding electrical junction of the polymeric substrate when the film is partially housed in the polymeric substrate.

A method of integrating a lidar system in a vehicle involves disposing one or more receive portions of the lidar system in one or more first locations of the vehicle and fabricating an integrated transmit portion of the lidar system to be disposed in a second location of the vehicle. The fabricating includes injection molding optical components to light emitting devices affixed to a printed circuit board to form a transmit portion and overmolding one or more additional elements to the transmit portion. The overmolding includes performing one or more additional injection molding processes.

An aerosol generating device includes: a case into which a cigarette is to be inserted; a cap detachably coupled to a top portion of the case; a cover configured to slide on a top surface of the cap so as to open or close a cigarette insertion hole; a first sensor configured to sense whether the cigarette insertion hole is open or closed; and a controller configured to determine whether the cigarette insertion hole is open or closed based on a signal sensed by the first sensor and set an operational mode of the aerosol generating device as an ON mode or an OFF mode based on a result of the determining.

A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.

To provide a control board for efficiently generating electric energy in a power generating device from heat generated from an electronic device. A control board includes a board including a first heat dissipating pad; an electronic device including a second heat dissipating pad to dissipate heat; a power generating device including a Peltier device which converts heat energy generated from the electronic device into electric energy, wherein the power generating device is sandwiched between the first heat dissipating pad and the second heat dissipating pad; and a power supply circuit configured to reuse the electric energy.

A thermoelectric module assembly for thermally conditioning a component is includes first and second heat spreaders spaced apart from one another and at least one thermoelectric sub-assembly between and in thermal communication with the first and second heat spreaders. The at least one thermoelectric sub-assembly includes a plurality of thermoelectric devices and a printed circuit board having a plurality of electrical conduits. Each of the thermoelectric devices has a first end portion and a second end portion, the second end portion opposite from the first end portion, the first end portion mechanically coupled to the printed circuit board and in electrical communication with the plurality of electrical conduits, and the second end portion spaced from the printed circuit board.