A terminal connector with better compatibility; comprising a cylindrical body, and the upper end of the cylindrical body is set with a coronal structure; an obconical structure is set on the cylindrical body, and the obconical structure is annularly protruded from the outer peripheral surface of the cylindrical body, the obconical structure is spaced apart from the coronal structure; the obconical structure comprises an annular upper end surface and an annular conical surface; through the design of the obconical structure, the diameter of the cylindrical body can be gradually increased from the bottom to the top of the obconical structure; wherein, a plurality of damping patterns is set on the annular conical surface of the obconical structure. The utility model can be compatible with the positioning holes of different apertures during the assembly with PCB and also has greater tolerance for the tolerance of the flatness of the PCB surface, and it has the advantages of saving production cost and high capacity utilization. In addition, the design of the neck improves the reliability of positioning on the carrier tape and the design of slope on the lower end surface of the coronal structure makes the product easily detach downwardly from the carrier tape, thereby improving the fluency of production.

A pin has a compliant section at a first end and a welding section at a second end opposite the first end. The compliant section is electrically connected with a via of a printed circuit board. The welding section has a welded connection with a passive component.

One illustrative method embodiment includes: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.

A method of manufacturing a semiconductor device prepares contact members, each of which has a cylindrical through-hole, and column-shaped connection terminals, each having a polygonal shape in a cross-sectional view along a length direction thereof, wherein a length of a diagonal of the polygonal shape is greater than an inner diameter of the through-holes. Chamfers with a curvature for fitting an inner surface of the through-holes are formed at corners of the connection terminal, and the connection terminals are press-fitted into the through-holes of the contacts. By doing so, the area of contact where the connection terminals press-fitted into the contacts contact the inner circumferential surfaces of the through-holes of the contacts is increased. This increases the tensile load of the connection terminals fitted into the contacts.

An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.

The invention relates to a method for mechanical connecting especially of a potting frame to a printed circuit board of an electrical/electronic module. The potting frame includes a metal contact area. The printed circuit board includes a surface area structured metallically corresponding to the contact area. The method includes positioning the mechanical component with the contact area facing the corresponding surface area, and soldering the mechanical component to the printed circuit board via the contact area and the surface area. The method the advantage that a material saving encapsulation can be provided for electrical/electronic modules in explosion endangered regions. An additional process step for mechanical connecting of the encapsulation to the printed circuit board can be omitted, since the mechanical connecting of the potting frame can be performed in one process step together with the soldering of the additional electrical/electronic components to the printed circuit board.

A terminal connector with better compatibility; comprising a cylindrical body, and the upper end of the cylindrical body is set with a coronal structure; an obconical structure is set on the cylindrical body, and the obconical structure is annularly protruded from the outer peripheral surface of the cylindrical body, the obconical structure is spaced apart from the coronal structure; the obconical structure comprises an annular upper end surface and an annular conical surface; through the design of the obconical structure, the diameter of the cylindrical body can be gradually increased from the bottom to the top of the obconical structure; wherein, a plurality of damping patterns is set on the annular conical surface of the obconical structure. The utility model can be compatible with the positioning holes of different apertures during the assembly with PCB and also has greater tolerance for the tolerance of the flatness of the PCB surface, and it has the advantages of saving production cost and high capacity utilization. In addition, the design of the neck improves the reliability of positioning on the carrier tape and the design of slope on the lower end surface of the coronal structure makes the product easily detach downwardly from the carrier tape, thereby improving the fluency of production.

An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.

A biocompatible electrical connection includes: a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The substrate includes a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and the second adhesive fills the annular space between the hole and the ferrule.