A user interface assembly for an appliance includes a user interface console having a first portion and a second portion. The first portion defines a first thickness, the second portion defines a second thickness, wherein the second thickness is greater than the first thickness. The user interface assembly also includes a user interface circuit board secured to the second portion of the user interface console. Further, the user interface assembly includes an edge connector electrically coupled to the user interface circuit board. As such, the second thickness of the second portion of the user interface console provides a clearance between the edge connector and the user interface console. The user interface assembly also includes a wired connection electrically coupled to the edge connector for electrically coupling the user interface circuit board to a controller of the appliance.

A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. The first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias.

A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

A filter module for reducing differential and common mode electrical noise may include at least a first electrically conductive busbar and a second electrically conductive busbar spaced apart from the first busbar, an at least partially electrically conductive housing at least partially enclosing the first busbar and the second busbar, at least a first common mode choke and a second common mode choke arranged in the housing and spaced apart from each other, at least a first bypass capacitor electrically connected to the first busbar and the second bus bar, at least a second bypass capacitor electrically connected to the first busbar and a midpoint, and at least a third bypass capacitor electrically connected to the second busbar and the midpoint.

Provided is a circuit board supporting structure capable of easily detaching a circuit board on a base. The circuit board supporting structure is configured to support a circuit board on a base, in which the base has a concave portion formed in a placement surface of the circuit board, and a rotational operation member configured to be rotatably accommodated in the concave portion and extend and retract in a direction perpendicular to the placement surface by a rotational operation, in which the circuit board has a through hole formed at a position corresponding to the concave portion, in which the rotational operation member has a reference surface formed approximately in parallel with the placement surface, and an operation portion formed on a rotational axis of the rotational operation member so as to be exposed from the through hole.

An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas on parallel spaced-apart printed circuit boards when the distal ends of the truss structure engage and are compressed between the two areas.

A MEMS board assembly, a LiDAR system including the same, and a method for making the same are disclosed. The exemplary MEMS board assembly includes a MEMS board having a plurality of through holes and a mount having a plurality of threaded holes. The MEMS board assembly further includes a plurality of spring-loaded posts each formed by fitting a spring into a respective post. The plurality of spring-loaded posts are fitted into the plurality of threaded holes of the mount. The MEMS board assembly also includes a plurality of screws fitting the MEMS board to the mount by reaching into the plurality of threaded holes of the mount through the plurality of through holes in the MEMS board and the plurality of spring-loaded posts. The MEMS board touches the plurality of spring-loaded posts at the plurality of through holes in the MEMS board corresponding to the plurality of threaded holes of the mount respectively.

In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

This heat dissipation structure includes: a circuit board; an integrated circuit mounted thereon; a first thermal pad disposed on the surface of the integrated circuit; a heat sink having a first surface that applies pressure to the first thermal pad by sandwiching the first thermal pad together with the surface of the integrated circuit and a second surface facing the first surface; a second thermal pad disposed on the second surface; a heat dissipation casing having a surface that applies pressure to the second thermal pad by sandwiching the second thermal pad together with the second surface; and stud components for pulling up the heat sink from the heat dissipation casing side together with the circuit board such that the second thermal pad is sandwiched and pressurized between the heat dissipation casing and the heat sink.

The present invention provides a winding assembly and a magnetic assembly. The winding assembly comprises a first coil and a circuit board, and the first coil is embedded inside the circuit board; wherein the first coil comprises a conductive wire with at least one turn, and a height of the conductive wire in a direction perpendicular to the circuit board is not less than a width of the conductive wire in a direction parallel to the circuit board. The magnetic assembly comprises a first winding assembly and a magnetic core; wherein the first winding assembly comprises a first coil and a first circuit board, and the first coil comprises a conductive wire with at least one turn, the first coil is embedded inside the first circuit board, the first winding assembly is assembled with the magnetic core.