In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

An electronic device is provided, including a working area and a peripheral area. The peripheral area is adjacent to the working area. The peripheral area includes a bonding area. The bonding area includes a first bonding pad area. The first bonding pad area includes a plurality of first bonding pads. A part of the first bonding pads are arranged along a first direction, and another part of the first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.

Provided are a battery apparatus including: a battery pack including a plurality of battery cells; a battery management system (BMS) for managing the plurality of battery cells; a board to which the BMS is mounted, the board including an insulation layer and a conductive layer; a plurality of wires extending from the plurality of battery cells onto the board; a plurality of through-holes formed in the board, the plurality of wires extending through the plurality of through-holes; a plurality of non-conductive areas, each of the plurality of non-conductive areas being formed on an area around a respective one of the plurality of through-holes; and a plurality of soldering parts, each of the plurality of soldering parts being formed on the respective one of the plurality of through-holes.

The invention relates to an overvoltage protection arrangement for information and telecommunication technology, consisting of a housing with means formed on the housing base for mounting top-hat rails, overvoltage protection elements which can be found in the housing, electric connection means, and at least one circuit board as a wiring support for the overvoltage protection elements. When viewed laterally, the housing is designed approximately in the shape of a T standing on its head and has a beam-shaped main part with a protruding head part, wherein the electric connection means can be accessed and actuated via the upper face of the beam-shaped main part. A first and second circuit board are located on a respective inner face of the lateral walls of the housing in a mutually spaced manner, and the electric connection means in the form of electric connection terminals, connection sockets, and/or plugs for example are arranged in the spacing between the first and second circuit board such that first connection means can be accessed on the horizontal plane of the beam-shaped main part and second connection means can be accessed on the vertical plane of the beam-shaped main part. The flat shape of the circuit board corresponds to the T shape of the housing or approximates the shape of the housing.

An electronic assembly that includes a rigid printed circuit board having an upper surface with a first plurality of lands. The electronic assembly further includes a flexible printed circuit board having a second plurality of lands on an upper surface. The lower surface of the flexible printed circuit board is directly attached to the upper surface of the rigid printed circuit board. The electronic assembly further includes a plurality of wires. Each of the wires is bonded to the first plurality of lands on the upper surface of the rigid printed circuit board and the second plurality of lands on the upper surface of the flexible printed circuit board.

A printed wiring board includes: a board having a through-hole; a land portion that is disposed on an inner circumferential surface of the through-hole and on a surface of the board at a circumferential edge of the through-hole, and that has a through-hole conductor portion; and a wire that is disposed on the surface of the board and that has one longitudinal end portion electrically connected to the land portion, a maximum length of a connection portion between the wire and the land portion being greater than or equal to a sum of a maximum diameter of the through-hole and a minimum line width of the wire.

A method for constructing a wireless communications apparatus includes attaching a three dimensional antenna having a first end and a second end to a printed circuit board (PCB) using a spring-loaded attachment mechanism. The three dimensional antenna is attached in an orientation that is perpendicular to a mounting surface of the PCB. The first end of the three dimensional antenna is further soldered to the PCB.

Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

The disclosure provides an electronic assembly that includes: a carrier element, a circuit carrier having a number of electronic components, a circuit board, which is electrically conductively connected to the circuit carrier, and a covering element for covering the circuit carrier. The covering element is arranged on one flat side of the circuit board and the carrier element is arranged on an opposite flat side of the circuit board. The circuit board is welded respectively to the carrier element and to the covering element. The disclosure further relates to a method for producing such an electronic assembly.