A method for inserting preformed solder members into connector pins for use with electrical connectors. The method generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are substantially eliminated. The method allows for inserting solder members in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that solder members can be inserted into large numbers of connector pins that are pre-installed in connector grommets, largely simultaneously.

The disclosure includes a housing including a first plate, a second plate, and a side member surrounding a space between the first and second plates, a printed circuit board disposed in the space and including an opening, a first conductive structure disposed in the space, a second conductive structure disposed in the space, and a flexible conductive member located between the first and second conductive structures through the opening to construct an electrical path between the first and second conductive structures. The flexible conductive member may include a base, a first flexible portion having a first height from the base, protruding from the base toward the first plate, and in contact with the first conductive structure, and a second flexible portion having a second height from the base, protruding from the base toward the second plate, and in contact with the second conductive structure.

A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.

A display device and a method of manufacturing the display device are capable of substantially minimizing damage to a display panel. The display device includes: a first substrate including a display area and a pad area; a polarization film disposed at an upper surface of the first substrate to overlap the display area; a flexible printed circuit board disposed at a lower surface of the first substrate; a via hole defined through the first substrate at the pad area; and a connection metal located at the via hole. The connection metal includes a connection portion disposed in the via hole and a first protruding portion that protrudes with respect to the first substrate, and the polarization film is spaced apart from the via hole in a plan view.

A combination structure of a clamping member and a circuit board for a signal connector is disclosed. The clamping member includes two clamping members fixedly connected to two sides of the circuit board. Each clamping member has a pair of first positioning pins and a pair of second positioning pins. Thereby, the center of the guide pin can be guided and the guide pin won't be loosened, so as to improve the stability of the signal and reduce the loss.

A printed circuit board comprises a board main body, a sensor, an external connection pad, and a hollow-structured electrical conductor. The board main body has a top face and a bottom face opposite the top face. The sensor is mounted on one of the top face and the bottom face of the board main body. The external connection pad is provided on the top face or the bottom face of the board main body opposite the sensor. The hollow-structured electrical conductor extends through the board main body and electrically connects the sensor to the external connection pad.

The disclosed system may include may include (1) a power socket receptacle that (A) fits within a via of a circuit board and (B) is inserted into the circuit board through one side of the via and (2) a power socket plug that (A) fits within the power socket receptacle and (B) is screwed into the power socket receptacle through another side of the via such that the power socket receptacle and the power socket plug collectively provide electrical continuity across the via. Various other apparatuses, systems, and methods are also disclosed.

An electrical assembly that includes a substrate having an aperture. A flat conductor is mounted to the substrate and extends over at least a portion of the aperture, with a ring terminal in contact with the flat conductor adjacent to the aperture. A lead wire connects to the ring terminal and is spaced from the substrate, and a fastener extends through the ring terminal and flat conductor, secured in the aperture, and securing the ring terminal against the flat conductor.

An interposer includes a housing having a plurality of through-holes penetrating a first surface and a second surface and a signal contact pair composed of a pair of signal contacts. Each of the signal contacts includes a base portion press-fitted in one of the through-holes, a first contact beam extending from the base portion beyond the first surface, and a second contact beam extending from the base portion beyond the second surface. The pair of signal contacts are positioned adjacently to each other widthwise and are each asymmetrical with respect to a width direction. A first minimum spacing between the first contact beams of the pair of signal contacts is narrower than a second minimum spacing between the base portions of the pair of signal contacts. The signal contact pair has a plane-symmetrical shape with respect to the width direction.

A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.