A PCB assembly includes a second PCB disposed adjacent to a first PCB and have a second hole facing a first hole, an upper plate disposed at an upper of the first and second hole and have a third hole disposed at the upper of the first hole and a fourth hole disposed at the upper of the second hole, a holder disposed at a lower of the first and second hole and have a lower plate having a fifth hole disposed at the lower of the first hole and a sixth hole disposed at the lower of the second hole, a first fixing screw penetrating through the third first, and fifth hole, and a second fixing screw penetrating through the fourth, second and sixth hole, and the lower plate includes a protrusion penetrating through the second PCB coupling the first PCB and the second PCB.

An integrated multilayer structure includes a substrate film including an electrically insulating material; a circuit design including electrically conductive elements provided on the substrate film, the conductive elements defining a number of contact areas; a connector at the edge of the substrate film, the connector including a number of electrically conductive elongated contact elements, such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector; and at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector.

A connector attached multi-conductor cable includes a multi-conductor cable and a connector that includes a circuit board including first to third surfaces. The circuit board includes first pads provided on the first surface and connected to central conductors of wires; second pads provided on the first surface, arranged in a first direction parallel to the third surface, and connected to the first pads; a first ground layer provided between the first and second surfaces, and extending in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member provided apart from the first pads in the second direction with respect to the second pads, and connected to the first ground layer. The conductive member is positioned on the first surface side with respect to the first ground layer in a third direction perpendicular to the first surface.

A flexible printed circuit board for pouch cell internal pressure measurement includes a sensing part on which a pressure sensor is mounted; a board part provided with connector pins connected to a plurality of conductor lines, respectively; and an extension part extending from the sensing part to the board part. The extension part includes a protective sheath of a metal material that surrounds an outer surface of an insulating film in a predetermined section.

An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.

An electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side member surrounding a space between the front plate and the rear plate and connecting one side of the front plate to one side of the rear plate, an antenna structure including at least part of the conductive portion, and a printed circuit board disposed in the space and including at least one processor. At least part of the side member is a conductive portion. The conductive portion includes a first conductive pattern, a second conductive pattern disposed at least partially coupled to the first conductive pattern, and a third conductive pattern disposed at least partially coupled to the first conductive pattern and spaced apart from the second conductive pattern. The antenna structure includes a first feeding part electrically connected to a first location of the first conductive pattern, a second feeding part electrically connected to a second location of the first conductive pattern, wherein the second location is closer to the third conductive pattern than the first location, a first ground part electrically connected to a third location between the first location and the second location of the first conductive pattern, a second ground part electrically connected to a fourth location between the second location and the third location of the first conductive pattern, a switch electrically connected to a fifth location between the first location and the third location of the first conductive pattern, a third ground part electrically connected to a sixth location of the second conductive pattern, and a fourth ground part electrically connected to a seventh location of the third conductive pattern.

Provided is a voltage monitoring module which includes: a land; and a metal plate arranged on the land and soldered to the land, in which a through-hole is partially formed at a location of the metal plate corresponding to the land, a non-formation area is formed at a location of the land corresponding to part of the through-hole, and no conductor is formed in the non-formation area.

An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.

The description relates to electronic prototyping platforms. One example can include an electrically insulative substrate having generally opposing first and second major surfaces and that includes an orientation feature that is visible on both of the first and second major surfaces. The example can include a first mounting hole through the substrate that is bordered by a first electrical conductor associated with data transmission. The example can also include a second mounting hole through the substrate that is bordered by a second electrical conductor associated with electrical ground, and a third mounting hole through the substrate that is bordered by a third electrical conductor associated with electrical power. The example can also include an edge connector tab defined by the substrate and having three exposed electrically conductive contacts that are coupled to the data electrical conductor, the ground electrical conductor, and the power electrical conductor and insulated from one another.

Method of manufacturing a metal-ceramic substrate (1) which, in the finished state, has a ceramic layer (11) and a metal layer (12) extending along a main extension plane (HSE) and arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE) comprising providing the metal layer (12) and the ceramic layer (11) and bonding the metal layer (12) to the ceramic layer (11) in regions to form a first region (B1), which has a materially bonded connection between the metal layer (12) and the ceramic layer (11), and a second region (B2), in which the metal layer (12) and the ceramic layer (11) are arranged one above the other without a materially bonded connection, as seen in the stacking direction (S).