Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power semiconductor die in the sub-modules to be reconfigured, such that when the removable jumpers are provided, the power module has a first function, and when the removable jumpers are removed, the power module has a second function. The removable jumpers may also allow for independent testing of the sub-modules. The power module may also include a multi-layer printed circuit board (PCB), which is used to connect one or more contacts of the power semiconductor die. The multi-layer PCB reduces stray inductance between the contacts and therefore improves the performance of the power module.

Embodiments of the present disclosure are directed towards techniques and configurations for layered interconnect structures for bridge interconnection in integrated circuit assemblies. In one embodiment, an apparatus may include a substrate and a bridge embedded in the substrate. The bridge may be configured to route electrical signals between two dies. An interconnect structure, electrically coupled with the bridge, may include a via structure including a first conductive material, a barrier layer including a second conductive material disposed on the via structure, and a solderable material including a third conductive material disposed on the barrier layer. The first conductive material, the second conductive material, and the third conductive material may have different chemical composition. Other embodiments may be described and/or claimed.

A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of U shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

An electronic device includes conductive leads, a conductive crossbar, and first and second bond wires. The conductive leads are arranged in a row along a side of a package structure and include a conductive first lead, a conductive second lead, and a conductive third lead. The first and second leads are non-adjacent, the third lead is between the first and second leads in the row, and the crossbar electrically connects the first and second leads. The first bond wire electrically connects a first conductive feature of a semiconductor die to one of the crossbar, the first lead, and the second lead, and the second bond wire electrically connects a second conductive feature of the semiconductor die to the third lead.

A circuit apparatus includes: a stacked body; and a plurality of terminals. The stacked body includes a plurality of layers. A plurality of holes that extend through the plurality of layers are formed in the stacked body. Each of the plurality of layers includes a connection member that is formed of a conductor. The connection member includes: a plurality of connection portions that are provided at positions corresponding to the plurality of holes; and a joining portion that connects the plurality of connection portions to each other. The plurality of terminals include a plurality of types of terminals that correspond to the plurality of layers. Each of the plurality of types of terminals can be selectively connected to the connection portion of a corresponding one of the plurality of layers by being inserted into a predetermined one of the plurality of holes.

A method, system, and apparatus for interconnecting multiple wires using a printed circuit board and a plurality of terminal blocks attached to the circuit board. Each terminal block includes a plurality of corresponding connection terminals including at least a first connection terminal and a second connection terminal. The printed circuit board includes a first conductive connection path interconnecting the first corresponding connection terminal of each of the plurality of terminal blocks and a second conductive connection path interconnecting the second corresponding connection terminal of each of the plurality of terminal blocks. Each connection terminal includes a connector adapted to selectively secure a conductive wire to the connection terminal.

Embodiments of the present disclosure are directed towards techniques and configurations for layered interconnect structures for bridge interconnection in integrated circuit assemblies. In one embodiment, an apparatus may include a substrate and a bridge embedded in the substrate. The bridge may be configured to route electrical signals between two dies. An interconnect structure, electrically coupled with the bridge, may include a via structure including a first conductive material, a barrier layer including a second conductive material disposed on the via structure, and a solderable material including a third conductive material disposed on the barrier layer. The first conductive material, the second conductive material, and the third conductive material may have different chemical composition. Other embodiments may be described and/or claimed.

A wiring board includes an electrical isolator or an interconnect element incorporated with a core substrate or metal leads and a bridging element straddling over interfaces between two adjoined surfaces to electrically connect a routing circuitry on the electrical isolator or on the interconnect element to another routing circuitry on the core substrate or to the metal leads. As the bridging element offers a reliable connecting channel without direct attachment to the interfaces, any cracking or delamination across the interfaces will not affect the routing integrity.

A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power semiconductor die in the sub-modules to be reconfigured, such that when the removable jumpers are provided, the power module has a first function, and when the removable jumpers are removed, the power module has a second function. The removable jumpers may also allow for independent testing of the sub-modules. The power module may also include a multi-layer printed circuit board (PCB), which is used to connect one or more contacts of the power semiconductor die. The multi-layer PCB reduces stray inductance between the contacts and therefore improves the performance of the power module.