A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of which is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers a part of a surface of the sealing resin on a side distant from the substrate. The surface of the sealing resin on the side distant from the substrate includes a shielded region covered with the shield film when viewed in a direction perpendicular to the first surface and a non-shielded region not covered with the shield film. The non-shielded region is superimposed on at least a part of the first conductive film.

An electronic device according to various embodiments may include: a circuit board; an electrical element disposed on an upper surface of the circuit board; a shield can surrounding at least a portion of the electrical element and having a first opening provided through a portion of the shield can facing the electrical element; a shielding sheet including a shielding layer disposed on at least a portion of the shield can and a support layer disposed on an upper surface of the shielding layer and including a second opening corresponding to the first opening; and a first heat transfer member comprising a heat dissipating material having at least a portion disposed inside the second opening and at least one surface in contact with the shielding layer.

Disclosed is an electronic device for determining the angular position of a shaft of a motor vehicle, the device including a printed circuit board and a magnetic guide including at least two fastening tabs for fastening to the printed circuit board, the printed circuit board including a base substrate and at least two fastening areas for fastening the magnetic guide, each designed to receive a fastening tab of the magnetic guide, the fastening tab defining a fastening orifice. Each fastening area is defined on the base substrate of the printed circuit board and includes a pad fastened to the base substrate. Each fastening tab is joined to the pad of the corresponding fastening area by way of an adhesive that is applied in its fastening orifice.

A module includes: a substrate having an upper main surface and a lower main surface arranged in an up-down direction; a metal member provided on the upper main surface of the substrate, the metal member having a plate-shaped portion including a front main surface and a back main surface arranged in a front-back direction; a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; and a sealing resin layer provided on the upper main surface of the substrate and covering the first electronic component, the second electronic component, and the metal member. The metal member includes an upper protruding portion extending on one side of the front-back direction from an upper end of the plate-shaped portion.

An electronic apparatus and heat dissipation and EMI shielding structure thereof are provided. The electronic apparatus includes a substrate, at least one chip disposed on the substrate, and the heat dissipation and EMI shielding structure. The heat dissipation and EMI shielding structure covers the chip and includes a shielding frame and a heat dissipation element. The shielding frame has an opening to expose the chip, and the heat dissipation element is disposed on the shielding frame and covers the opening. The conjunction of the shielding frame and the heat dissipation element can protect the chip from being interfered with electromagnetic waves, and the heat generated by the chip can be dissipated by the heat dissipation element.

A voltage divider circuit assembly includes resistors, an external electrostatic shield, and internal electrostatic shield(s). The resistors are in series with each other between input terminals that receive an input voltage. An external resistor is disposed between sensing terminals that conduct an output voltage that is the input voltage divided by the resistors in the series. The external shield is conductively coupled with the series of the resistors with the external resistor disposed outside of the external shield and the other resistor(s) inside the external shield. The internal shield(s) are conductively coupled with the resistors and disposed inside the external shield. A first internal resistor is disposed inside the external shield and outside of the internal shield(s). One or more remaining resistors are inside the internal shield(s). The shields divide parasitic capacitances to enable the measurement of dynamically changing high voltage input signals.

An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The metal member further includes one or more foot portions extending forward or backward from the lower side.

A microwave generator for a microwave device includes a single component carrier for control components and power components, which includes a continuous carrier material. Two power regions and one control region are provided on the component carrier. In the control region, electrically functional components are arranged on both flat sides of the component carrier, while in the power regions, electrically functional components with at least one power switch are arranged only on an upper flat side, heat sinks being arranged on the lower flat side. An RF substrate is provided in regions on the upper flat side of the power region.

A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.