A component carrier intermediate product includes a first electrically-insulating layer structure; an at least partially uncured and patterned second electrically-insulating layer structure having recesses, wherein the recesses are filled by an electrically-conductive material; and a component carrier section arranged on the at least partially uncured and patterned second electrically-insulating layer structure.

A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.

A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.

An object is to obtain a power conversion device that can suppress the generation of noise due to coupling and achieve the size reduction of a substrate. In a power conversion device, a main circuit wire for connecting main circuit components to form a main circuit includes a first main circuit wire and a second main circuit wire wired so as to be separated from each other on a substrate. A control wire is wired between the first main circuit wire and the second main circuit wire so as to be insulated therefrom, and the first main circuit wire and the second main circuit wire are connected to each other via the main circuit component placed so as to be separated from the control wire in the thickness direction of the substrate.

Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.

An example electronic device includes a housing, a first board and a second board disposed in an interior of the housing and disposed to face each other in a first direction, an interposer extending to surround an interior space between the first board and the second board, a first conductive layer disposed to face the first board and including a first conductive area, a second conductive layer disposed to face the second board and including a second conductive area, an insulation layer disposed between the first conductive layer and the second conductive layer, a first insulation part disposed between the first conductive layer and the first board and covering the first conductive area, a second insulation part disposed between the second conductive layer and the second board and covering the second conductive area, a first plating area extending from the first conductive layer to the second conductive layer, on a first side surface of the insulation layer, and a second plating area extending from the first conductive layer to the second conductive layer, on a second side surface of the insulation layer.

A terrestrial vehicle lighting module which includes an electroluminescent source including at least one electroluminescent element, an electronic device designed to control the electroluminescent element, and an interposer electrically connecting the electroluminescent source and the electronic device.

An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.

According to various embodiments of the disclosure, an electronic device may comprise: a display, a first circuit board disposed under the display, at least one component disposed on one surface of the first circuit board, an interposer surrounding at least two sides of the at least one component and disposed on the first circuit board, and a second circuit board spaced apart from the first circuit board and including an area joined with the interposer. The interposer may include: a first interposer portion disposed along a first area of the first circuit board, a first end of the first interposer having at least a portion including a non-shielding area, and a second interposer portion disposed along a second area, adjacent to the first area, of the first circuit board, a second end of the second interposer facing the first end and having at least a portion including a non-shielding area.

An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second region of the first circuit board, the second second circuit board including a first second portion bonded to the second interposer and spaced apart from the first second circuit board by a specified gap.