The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.

A high frequency connector includes a case, a circuit board, a component protecting member and a cable. The circuit board is configured in the case and includes an electronic component and a plurality of solder pads. The component protecting member includes a case body and is configured on the circuit board. One side of the case body has an opening, and a containing space is formed between the opening and the inner face of the case body. A crossing structure is formed by the outer surface of the other side of the case body. When the component protecting member is configured on the circuit board, the component protecting member covers the electronic component in the containing space to maintain the transmission characteristics of the electronic component.

An electrical interconnection system for electrical components of a module includes a hub printed circuit board (PCB) having a first electrically conductive track and a second electrically conductive track. Each of the first and second electrically conductive tracks is configured to electrically connect at least two of the electrical components of the module, wherein the at least two of the electrical components of the module are external to the hub PCB. The system also includes multiple electrical terminals, wherein each of the electrical terminals is configured to electrically connect one of the first and second electrically conductive tracks of the hub PCB to one of the at least two electrical components of the module.

The invention relates to an electric contact assembly for electrically contacting a printed circuit board or the like, comprising an installation ring (3) with an opening (3a), said installation ring (3) being designed to be fixed to the printed circuit board (11), and comprising a press-in pin (2) with a first zone (21) and a second zone (22), wherein the first zone (21) has a greater degree of mechanical flexibility than the second zone (22), and the first zone (21) is designed to be connected to another electronic component. The second zone (22) is assembled in the opening (3a) of the installation ring (3) by means of a first interference fit (4).

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

A semiconductor storage device includes: a printed circuit board; a nonvolatile memory disposed on the printed circuit board; a memory controller disposed on the printed circuit board and configured to operatively control the nonvolatile memory; a capacitor disposed on the printed circuit board and configured to supply power to the nonvolatile memory and the memory controller; and at least one holder that holds the capacitor at an end portion of the printed circuit board. The holder includes a connecting portion connected to the end portion of the printed circuit board, and a pair of arm portions extending from the connecting portion toward an outside of the printed circuit board and configured to sandwich a body portion of the capacitor from both sides in a thickness direction of the printed circuit board.

Embodiments disclosed herein include electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first substrate and a plurality of first conductive pads on the first substrate. In an embodiment, the electronics package further comprises a second substrate and a plurality of second conductive pads on the second substrate. In an embodiment, the electronics package further comprises a plurality of interconnects between the first and second substrate. In an embodiment, each interconnect electrically couples one of the first conductive pads to one of the second conductive pads. In an embodiment, the interconnects comprise strands of conductive material that are woven on themselves to form a mesh-like structure.

One aspect provides an apparatus for locking circuit boards in position between a pair of guide rails. The apparatus can include a slider attached to a sidewall of one guide rail. The slider is allowed to slide along the guide rail within a predetermined range and one or more plunger-and-spring assemblies. A respective plunger-and-spring assembly comprises a plunger and a spring surrounding the plunger, and the plunger is inserted into a through-hole on the sidewall of the guide rail such that a first end of the plunger can be aligned with a notch on a corresponding circuit board and a second end of the plunger is in contact with the slider. Sliding of the slider causes the spring to compress and decompress and the first end of the plunger to move in and out of the notch on the circuit board, thereby facilitating locking and unlocking of the circuit board.

An implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

A flexible electronic foil (1,1′,1″) comprising a flexible substrate (2) and at least one electrically conducive portion (3) arranged to the substrate (2). The foil (1,1′,1″) comprises mechanical fastening means (6,6′,7) for mechanical fastening of the electronic foil (1,1′,1″), the mechanical fastening means being part of the substrate (2) of the electronic foil (1,1′,1″).