A soft neural interface connector apparatus includes a PCB having a two-dimensional array of solder balls, a transparent top board, a cushioning layer on one side of the transparent top board, and a soft neural interface including a flexible and/or stretchable microelectrode array (MEA) through which neural signals are obtained or delivered. The MEA includes a two-dimensional array of contact pads corresponding to the array of solder balls. The PCB, the transparent top board, the cushioning layer, and the MEA are stacked together such that the MEA is between the cushioning layer and the PCB, and the contact pads are aligned with and in electrical contact with associated solder balls. A magnetic connector system having at least one magnetic connector component on the transparent top board is magnetically connected with at least one magnetic connector component on the PCB to press the contact pads and associated solder balls together.

A positioning fastener includes a base having a seat plate extended therefrom, a fixing portion disposed below the base for fastening to an electronic substrate, and an elastic positioning structure disposed above the base and including an urging plate, a pressing plate connected to the urging plate, a positioning space defined therein and a positioning member disposed at a bottom side thereof. The urging plate and the pressing plate are squeezed backwards and elastically deformed by a circuit board that is rotated downward so that the circuit board passes the urging plate and moves into the positioning space of the elastic positioning structure and a suspended board edge of the circuit board is secured in position by the positioning member. The pressing plate can be pressed by an external force to lift the urging plate, allowing the circuit board to be rotated in direction away from the positioning member.

A securing mechanism for retaining a CPU to an electrical connector mounted upon a top surface of the PCB, includes a fastening device mounted upon the top surface of the PCB beside the electrical connector, and a back plate mounted upon the undersurface of the PCB and located between the PCB and a metallic case. The fastening device cooperates with the back plate to be secured to the PCB via a first set of fixing units. The case forms an opening/recessed region to receive a thickened central region of the back plate and is secured to the back plate via a second set of fixing units surrounding said opening. The thickened central region is fully received within the opening in the vertical direction. The first set of fixing units are located in the central region of the back plate.

There are provided an electrical connection structure, an electrical connection method and an electric connector capable of improving contact reliability, and an electric device including the electrical connection structure. The electrical connection structure includes a swage part configured to sandwich a first electric conductor and a sheet member having a second electric conductor, and an elastic member provided between the first electric conductor and the sheet member in a sandwiching portion of the swage part, the elastic member being configured to connect between the first electric conductor and the sheet member. The first electric conductor and the second electric conductor are electrically connected to each other via a contact point provided in the first electric conductor and a contact point provided in the second electric conductor in the sandwiching portion.

A system for transferring heat from printed circuit boards (PCBs) with light emitting diodes (LEDs) includes a PCB having a first side and a second side and configured to be coupled to an exterior portion of an aircraft. The system further includes a LED located on the first side of the PCB. The system further includes a first metal strip located on the second side of the PCB. The system further includes a heat sink configured to contact the first metal strip to dissipate heat from the PCB.

An electrical interconnection system for electrical components of a module includes a hub printed circuit board (PCB) having a first electrically conductive track and a second electrically conductive track. Each of the first and second electrically conductive tracks is configured to electrically connect at least two of the electrical components of the module, wherein the at least two of the electrical components of the module are external to the hub PCB. The system also includes multiple electrical terminals, wherein each of the electrical terminals is configured to electrically connect one of the first and second electrically conductive tracks of the hub PCB to one of the at least two electrical components of the module.

The present disclosure provides a testing fixture for holding a device under test (DUT). The testing fixture includes a base, a frame, a recessed portion, a plurality of sets of electrical contacts and a plurality of electrical lines. The frame extends upward along an outer perimeter of an upper surface of the base. The recessed portion is surrounded by the frame and the upper surface of the base, and the DUT is received in the recessed portion. The plurality of sets of electrical contacts are disposed on the recessed portion and arranged in a rotationally symmetrical manner, wherein a plurality of plated through holes of the DUT are in contact with one set of the electrical contacts after the DUT is assembled with the testing fixture.

A heat spreader configured for use with a dual-in line memory module (DIMM) is provided. The heat spreader comprises a thermally conductive body having upper and lower edges with a first length, opposing side edges with a second length less than the first length, and a planar surface configured for attachment to a plurality of co-planar semiconductor devices of the DIMM, and a retaining clip configured to releasably attach the thermally conductive body to the DIMM when disposed within a side notch of the DIMM and around a first one of the opposing side edges of the thermally conductive body.

The present disclosure provides a power module, a power module assembly and an assembling method thereof. The power module assembly includes a housing, a resilient bracket, a circuit board, a power device and a fastening unit. The housing includes a first heat-dissipation surface. The resilient bracket is pre-fastened on the housing. The resilient bracket is located near the first heat-dissipation surface and configured with the first heat-dissipation surface to form an accommodating space. The circuit board is configured to assemble on the housing. The power device is plugged in the circuit board and accommodated in the accommodating space. The fastening unit is pre-fastened on the housing and pressing the resilient bracket. While the resilient bracket pushes against the power device, the power device is attached to the first heat-dissipation surface.

A memory module connector includes a memory module receiving slot configured to receive a memory module. The memory module connector further includes a restraining mechanism configured to release the memory module if a force applied by the memory module to the restraining mechanism is above a pre-determined force threshold.