The present disclosure relates to a structure for electrically-connecting an external conductor. The structure comprises a wiring-substrate comprising a stack based arrangement of a plurality of layers, wherein said layers are defined as electrically conducting layers and insulating layer. A rivet is supported from the wiring substrate and comprises an embedded portion within the wiring substrate. The embedded portion comprises: an upper section extending through the stack of the plurality of layers, and, a bottom section extending laterally with reference to the upper section. A portion protruding from wiring substrate is provided for receiving an external-conductor and for thereby electrically connecting with the wiring substrate.

A printed circuit board (100) includes a front layer (30) including frame ground regions (102a, 102b) on which connectors (202, 203) to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region (101) which is separated from the frame ground regions at the front layer, on which electronic devices (200, 201) configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region (103) separated from the frame ground regions (102a, 102b) and the signal ground region (101) at the front layer, situated outside the frame ground regions (102a, 102b), and connected with a ground.

The present disclosure generally relates to a scalable computer circuit board having a first power level semiconductor package coupled to at least one base-level voltage regulator module, which is coupled to a plurality of connection receptacles that are configured for connecting with a voltage regulator module positioned on a second level, as a standardized base unit. To scale the base unit, a second power level semiconductor package may be exchanged for the first power level semiconductor package in conjunction with one or more voltage regulator module board being positioned over a corresponding number of base-level voltage regulator modules and coupled to their plurality of connection receptacles.

Provided are a flexible flat cable and a method of producing the same. The flexible flat cable includes a plate-shaped first insulation portion comprising an insulating material; a first ground, a second ground, and a third ground disposed at predetermined intervals on the first insulation portion; at least one first signal transmission line positioned between the first ground and the second ground and disposed on the first insulation portion; at least one second signal transmission line positioned between the second ground and the third ground and disposed on the first insulation portion; a first second insulation portion disposed on at least a portion of the first ground and at least a portion of the at least one first signal transmission line and the second ground; a second second insulation portion disposed on at least a portion of the second ground and at least a portion of the at least one second signal transmission line, and the third ground; a conductive adhesive layer configured to enclose the first insulation portion, the first second insulation portion, and the second second insulation portion; and a shielding portion comprising a shielding material adhered to an outside of the conductive adhesive layer. Therefore, by improving shielding efficiency of a plurality of signal transmission lines, while having good electromagnetic interference and crosstalk characteristics, a plurality of signals can be simultaneously transmitted.

A component for a vehicle electric drive is described, which includes at least one connecting lug pair projecting from the component for electrically connecting the component. Here, a first connecting lug and a second connecting lug of the connecting lug pair each have a joining zone for electrically connecting the component. Furthermore, an assembly for a vehicle electric drive is presented, which has at least two such components. Further presented is a method of electrically conductively connecting two components.

An arrangement is illustrated and described. The arrangement includes a component carrier including ia) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ib) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier; ii) the further component carrier connected with the component carrier by the at least one elastic element, wherein the further component carrier includes: iia) a further recess configured such that the component carrier is at least partially placeable into the further recess; iii) the component carrier is a smaller unit than the further component carrier, and iv) the component carrier is at least partially placed into the further recess.

The present application provides an SSD card adapter bracket and a circuit board assembly. The SSD card adapter bracket includes a bracket member, a first screw, a conductive bouncing sheet, and a second screw. The bracket member includes a card base part and an extension part, and one side of the card base part is provided with a screw base. One side of the extension part is connected to the card base part, and the other side of the extension part is provided with a connection part. The first screw is threadedly connected to the screw base, and can press the SSD card to the screw base. The conductive bouncing sheet has a first end part and a second end part, the first end part is sandwiched between the first screw and the screw base, and the second end part corresponds to the connection part.

Discussed is an organic light emitting diode display device, including a display panel including an array substrate configured to display an image, a face sealing metal layer under the array substrate, and a protecting substrate under the face sealing metal layer, wherein the array substrate generates heat, and the generated heat is transferred from the array substrate to the protecting substrate via the face sealing metal layer to be radiated by the protecting substrate; and a printed circuit board under the protecting substrate, wherein an end portion of the array substrate, an end portion of the face sealing metal layer and an end portion of the protecting substrate form a stepped structure.

A shield enclosure includes a housing with a peripheral wall that defines a cavity, and a cover removably coupleable to the housing to at least partially seal the cavity. The cavity is sized to receive a printed circuit board therein. The housing shields the printed circuit board from electromagnetic interference and noise during noise figure testing of a radiofrequency component on the printed circuit board.

A board-like connector, a dual-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-arm bridges spaced apart from each other and an insulating layer. Each of the dual-arm bridges includes a carrier, a first cantilever, a second cantilever, a first abutting column, and a second abutting column, the latter two of which extend from the first and second cantilevers along two opposite directions. The first cantilever and the second cantilever extend from and are coplanar with the carrier. The insulating layer connects the carriers of the dual-arm bridges. The first abutting column and second abutting column of each of the dual-arm bridges respectively protrude from two opposite sides of the insulating layer, and are configured to abut against two boards, respectively.