A light-emitting module includes a first mounting board having a first surface and a second surface opposite to the first surface. The first mounting board has a recess on the first surface, and the recess has a bottom surface. The first mounting board has an opening passing through the first mounting board from the bottom surface to the second surface. The light-emitting module further includes a second mounting board provided in the recess, a light-emitting element provided on the second mounting board and configured to emit light through the opening, and an elastic cushion provided between the first mounting board and the second mounting board. The light-emitting module also includes a connector. The connector and the opening sandwich a center of the first mounting board when viewed from a direction from the second surface to the first surface.

An electric motor includes a rotor assembly, a stator assembly, a printed circuit board, and a solder cup. The stator assembly includes a lamination stack defining teeth, coils supported about the teeth, and a conductive terminal electrically connected to at least one coil. The conductive terminal includes a lead portion. The printed circuit board is coupled to the stator assembly and includes opposed first and second sides, and a through hole extending through the printed circuit board and receiving the lead portion. The printed circuit board further includes a solder pad surrounding the through hole on at least one of the first side or the second side. The solder cup is supported on the lead portion between the printed circuit board and the stator assembly, and includes a wide end facing toward the printed circuit board, and a narrow end opposite the wide end.

A printed circuit board comprises N power switching cells operating in parallel and respectively comprising a transistor leg, at least one decoupling capacitor and a gate driver circuit. Each transistor leg comprises respective first and second transistors in series, a drain of the first transistor being connected to a positive DC line, a source of the second transistor being connected to a negative DC line, a source of the first transistor being connected to a drain of the second through a connection middle-point connected to an output terminal. Each gate driver circuit controls respective switching ON and OFF of the corresponding first and second transistors. The N transistor legs of the corresponding N power switching cells are positioned to substantially form a convex polygon having N edges of substantially the same length, each one of the N transistor legs being positioned along one of the edges of the convex polygon.

A driving tool for driving jackset screws includes an input shaft, output shafts, gear assembly, driver heads, and a yoke. The input shaft is configured to receive torque. The first and second output shafts are operably connected to the input shaft via the gear assembly. The gear assembly includes a differential gear assembly rotatably engaged with the input shaft. The first driver head is attached to a distal end of the first output shaft. The second driver head is attached to a distal end of the second output shaft. The yoke is connected to and extends between ends of the first and second output shafts. The yoke defines a position of the distal ends of the first and second shafts relative to each other and is configured to adjust a distance between the first and second driver heads.

An apparatus according to one embodiment of the present disclosure comprises a first circuit board; a first connector provided on one face of the first circuit board; a second circuit board disposed on the one face of the first circuit board, and electrically connected to the first circuit board; a second connector provided on one face of the second circuit board, and engaged with the first connector to electrically connect the second circuit board to the first circuit board; a sealing member disposed between the first circuit board and the second circuit board to seal a space between the first connector and the second connector; and a coupling member coupling the first circuit board and the second circuit board to each other.

Cowlings described herein for board-to-board connectors can provide high stiffness, low weight, and low total cost. Such cowlings can provide ribs with increased thickness for targeted stiffness to resist bowing in a given direction. The layers of the cowlings can include carbon fiber extending in directions parallel to the ribs in some layers and transverse to the ribs in other layers. The layers can be formed together within a mold tool that shapes the fibers into the ribs.

An electronic device is provided, including a first circuit board, a second circuit board, a supporting member, and a first locking member. The first circuit board has a first hole. The second circuit board has a second hole, a pin, and a metal connector, wherein the pin is connected to the first circuit board. The supporting member has a first portion disposed in the first hole, a second portion, and a screw hole extending from the first portion to the second portion, wherein the diameter of the first portion is less than that of the second portion. The first locking member passes through the second hole and enters the screw hole to affix the second circuit board to the supporting member. The second portion is disposed between the first circuit board and the second circuit board to form a gap therebetween.

Apparatuses, systems and methods associated with electrical fast transient tolerant input/output (I/O) communication (e.g., universal serial bus (USB)) design are disclosed herein. In embodiments, an apparatus to mount an integrated circuit (IC) package, may include a printed circuit board (PCB), a plurality of pogo pins, and a mounting mechanism. The plurality of pogo pins may be mounted to electrical contacts of the PCB, the plurality of pogo pins may be coupled to the electrical contacts at first ends of the plurality of pogo pins and may be to couple to the IC package at second ends of the plurality of pogo pins. The mounting mechanism may position the IC package on the second ends of the plurality of pogo pins. Other embodiments may be described and/or claimed.

An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.

A printed circuit board (PCB) system includes an integrated circuit (IC) package having a main IC chip that is electrically coupled to a top surface of a package substrate. A first printed circuit board (PCB) is electrically coupled to first contact structures on a bottom surface of the package substrate. A heat dissipation member is coupled to the main IC chip. A memory module is configured to electrically couple, via an interposer, with second contact structures on a top surface of the package substrate while the heat dissipation member dissipates heat from the main IC chip away from one or more memory IC chips on the memory module. The interposer is configured to electrically couple the second contact structures of the IC package with the memory module while the heat dissipation member dissipates heat from the main IC chip away from the one or more memory IC chips.