An electronic device may include a circuit board, an IC carried by the circuit board, and an RF shield above the IC. The circuit board may include a dielectric layer, and a thermally conductive body in the dielectric layer. The thermally conductive body may have a first heat transfer surface coupled to the IC. The thermally conductive body may extend laterally within the dielectric layer and outward past the RF shield and defining a second heat transfer surface. The electronic device may include a heat sink coupled to the second heat transfer surface.

A heat radiating member includes a body region having a first main surface and a second main surface opposing each other and lateral surfaces connecting the first main surface and the second main surface and having concave surfaces, and a curved surface region formed to have a convex surface on an edge at which at least one of the first main surface and the second main surface meets one of the lateral surfaces.

A component carrier includes a multi-layer carrier body having a substrate containing a structured functional. The substrate extends both laterally and also at least partially above and below the functional region. Alternatively, or in addition, the substrate extends both laterally and also completely above and/or below the functional region. Alternatively, or in addition, the substrate or a further region is arranged in or extends into the functional region.

An electronic device includes a press-fit terminal, an electronic component and a substrate. The substrate includes a first through hole, a second through hole and an inlay. The press-fit terminal is press-fitted in the first through hole. The second through hole is located between the first through hole and a part of the substrate at which the electronic component is mounted. The inlay is made of a metal material and press-fitted in the second through hole. The inlay restricts a strain in the substrate and restricts decrease of a holding force of the substrate holding the press-fit terminal.

A printed circuit board includes a substrate base including first and second inner base layers, a plurality of cover base layers, and a screw hole extending from a top to a bottom surface of the substrate base. At least one first cover base layer is disposed on the first inner base layer. At least one second cover base layer is disposed on the second inner base layer. A heat pipe is disposed along an interface between the first and second inner base layers. A ground conductive layer is disposed on at least one of the top surface and the bottom surface of the substrate base at an edge of the screw hole. A first heat dissipating structure is positioned between the top and bottom surfaces of the substrate base. The first heat dissipating structure is connected to the heat pipe and is in direct contact with the ground conductive layer.

A printed circuit board with integrated coil includes: a plurality of layers; and coil patterns which are formed of a conductor and which are provided in at least one outer surface layer and another layer of the plurality of layers. A heat-dissipation pattern formed of a conductor is provided on at least the one outer surface layer so as to correspond to the coil pattern provided in the another layer. The coil pattern provided in the one outer surface layer and the heat-dissipation pattern provided in the one outer surface layer are separated from each other. A thermal inter-layer connector formed of a conductor is provided to connect the coil pattern provided in the another layer and the heat-dissipation pattern provided in the one outer surface layer which correspond to each other.

The present disclosure relates to an air-cavity package, which includes a bottom substrate with a first heat dissipation interface, a top substrate with a second heat dissipation interface, a perimeter wall, a bottom electronic component, and a top electronic component. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and thermally coupled to a bottom thermally conductive structure, which extends through the bottom substrate and towards the first heat dissipation interface. The top electronic component is mounted on the top substrate, exposed to the cavity, and thermally coupled to a top thermally conductive structure, which extends through the top substrate and towards the second heat dissipation interface.

A metal pallet is integrated within a circuit board using a process similar to a multilayer PCB, which integrates the metal pallet into the circuit board at the same time as the supporting layers are fabricated. The use of B-stage material provides a bonding mechanism for the metal pallet to be embedded within the circuit board, creating a cohesive integrated part. Embedding the pallet during the fabrication process, pre-lamination, generates a more robust construction and connection not impacted by post fabrication process in assembly. After assembly the circuit board with embedded metal pallet can be mounted directly on a heat sink, cool ribbon or other feature required to help remove heat. The planar back side surface provides a more robust mounting of the metal pallet than a post fabricated assembly as used in conventional techniques.

A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a combined component accommodated in the cavity of the substrate, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, and a filling resin filling gap formed between the cavity and combined component accommodated in the cavity of the substrate. The combined component includes an electronic component and a metal block, the electronic component has terminal surface on side facing the first surface of the substrate, and the metal block is superposed to surface of the electronic component on the opposite side of the electronic component with respect to the terminal surface.

An electronic device includes: a first printed circuit board (PCB) including a first plate and a first hole formed in the first plate, a second PCB including a second plate, an interposer including a third plate positioned between the first plate and the second plate, a plurality of first vias connecting the first plate and the third plate, a plurality of second vias connecting the second plate and the third plate, and a first reinforcement portion positioned in the first hole to bond the first plate and the third plate.