A wiring substrate in which a plating layer is sufficiently plated on a surface metal layer and which has an excellent reliability is provided. A wiring substrate includes an insulating base; a heat dissipation member disposed in the insulating base, the heat dissipation member partially exposed from the insulating base, the heat dissipation member containing Cu; a surface metal layer disposed on a surface of the insulating base, the surface metal layer contacting and covering the heat dissipation member, the surface metal layer containing Mo as a main component, the surface metal layer including a surface portion containing Cu; and a plating layer disposed on the surface metal layer, wherein Cu contained in the heat dissipation member and Cu contained in the surface portion are bonded to each other.

A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.

Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

A thermally-efficient electrical assembly comprising: an electrically-conductive layer; a heat sink layer; an electrically-insulating interconnecting layer interposed between the electrically-conductive layer and heat sink layer; an electrical component in electrical communication with the electrically-conductive layer; and a metallic thermal bridge in thermal communication with the electrical component and in direct contact with the heat sink layer, thereby bypassing the electrically-insulating layer.

An aircraft light comprises a light source support board, having a light source side and a back side; and a light source, arranged on the light source side of the light source support board; wherein the light source support board comprises a first metallic layer, the first metallic layer forming conductive traces on the light source side of the light source support board; an isolating layer; a second metallic layer, wherein the isolating layer is arranged between the first metallic layer and the second metallic layer and isolates the second metallic layer from the first metallic layer; and a support board core layer. A cavity is provided in the support board core layer.

A method for forming a thermal and electrical path in a PCB may include forming a first removable layer over a top surface of a PCB and a second removable layer over a bottom surface of the PCB. The method may also include milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB, plating the first side panel plating the first side with a second metal to partially fill the first cavity; and milling or laser drilling from the bottom surface to form a second cavity extending into the PCB, the first cavity in a thermal communication and/or an electrical communication with the second cavity. The method may also include panel plating the first side with a second metal to fill the first cavity and the second side with the second metal to fill the second cavity, and removing the first and second removable layers from the PCB to form the PCB with a thermal and/or an electrical path comprising the first cavity and the second cavity filled with the second metal.

A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an inner routing layer that is coplanar with, and coupled with, the slug.

An electronic modular unit having electronics has a printed circuit board, a housing receiving the electronics and an electrical conductor. The conductor is in this connection directly soldered with a flat connection end to a contact surface of the printed circuit board. In order to simplify the soldering process, a spring element is arranged in the housing and presses the connection end of the conductor on the contact surface of the printed circuit board for the purpose of fixing the connection end during soldering. The modular unit is, in particular, a capacitive proximity sensor for a vehicle.

A heat radiating member includes a body region having a first main surface and a second main surface opposing each other and lateral surfaces connecting the first main surface and the second main surface and having concave surfaces, and a curved surface region formed to have a convex surface on an edge at which at least one of the first main surface and the second main surface meets one of the lateral surfaces.

Coil patterns are provided in first and second outer surface layers and an inner layer of the board. First and second heat-dissipation patterns are provided in the second outer surface layer. A first thermal inter-layer connection member connects the coil pattern of the first outer surface layer and the first heat-dissipation pattern. A second thermal inter-layer connection member connects the coil pattern of the inner layer and the second heat-dissipation pattern. The coil pattern provided in the second outer surface layer and the first and second heat-dissipation patterns are separated from each other. An area of the second heat-dissipation pattern is larger than an area of the first heat-dissipation pattern.