An embodiment of a solder wettable flange includes a flange body formed from a conductive material. The flange body has a bottom surface, a top surface, sidewalls extending between the top surface and the bottom surface, and one or more depressions extending into the flange body from the bottom surface. Each depression is defined by a depression surface that may or may not be solder wettable. During solder attachment of the flange to a substrate, the depressions may function as reservoirs for excess solder. Embodiments also include devices and systems that include such solder wettable flanges, and methods for forming the solder wettable flanges, devices, and systems.

A module for use in a hardware platform for networking, computing, or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side has greater vertical clearance than the secondary side; at least one component mounted on the secondary side, the at least one component being placed on the secondary side due to an increased complexity and component density on the printed circuit board assembly preventing its placement on the primary side; and a floating heatsink assembly disposed on the secondary side to dissipate heat from the at least one component, the floating heatsink assembly being biased against the at least one component by at least one resilient member arranged within a limited vertical space on the secondary side.

Printed circuit board (100) for electrical components (5) and/or conductor paths (4), comprising: a base body (2) which extends along a main extension plane (HSE), and an insert (1) which is integrated into the base body (2) in the assembled state,

wherein the insert (1) is a metal-ceramic substrate (10), the metal-ceramic substrate (1) being covered, in particular surrounded, at least partially by an insulating element (8) on a side surface (SF) facing the base body (2) in the assembled state.

A control and command electronic assembly (20,20) for a groundskeeping tool is described, said control and command electronic assembly comprising a heat sink body (60,60) and a control and command electronic board (25,25), said electronic board comprising: a support plate (30,30) provided with a first major face (35,35) and an opposite second major face (40,40), a plurality of electronic components (45,50) fixed to the support plate (30,30) and comprising at least one electronic component (45), which generates heat that must be dissipated by means of the heat sink body and which has a predetermined height from the major face, between the first and the second, on which it is fixed of the support plate, and a connection body (55) fixed to the support plate (30,30) and adapted to allow the removable connection to the electronic board (25,25) of a cable, and/or another electronic component (50) of the plurality of electronic components, which is fixed to the support plate (30,30) and has a predetermined height from a portion of the plate on which it is fixed that is greater than the predetermined height of the electronic component whose heat is to be dissipated. Wherein the heat sink body comprises a base face (65,65) facing onto the first major face (35,35) of the support plate and the connection body (55) and/or the other electronic component (50) is fixed to the second major face (40,40) of the support plate.

The disclosure relates to an electronic device including a thermally and electrically conductive transmission element configured to dissipate heat from a heat source, wherein the transmission element is at a first electric potential and includes rounded edges. The electronic device further includes a heat sink at a second electric potential and an electrically insulating layer arranged between the heat sink and the transmission element in order to connect the transmission element to the heat sink in a thermally conductive manner.

A micromobility transit vehicle may include a wheel, an electric motor associated with the wheel, and a motor controller configured to control a motive force provided by the electric motor to the wheel. The motor controller may include a printed circuit board (PCB), one or more MOSFETs attached to the PCB, and a respective aperture defined through the PCB below each MOSFET. The motor controller may include a thermal assembly associated with each MOSFET and capable of dissipating heat from the MOSFETs to a heat sink. Each thermal assembly may include a heat transfer plug positioned at least partially within an associated aperture of the PCBA to contact an associated MOSFET, and a thermal interface material positioned between the heat transfer plug and the heat sink and capable of dissipating heat from the heat transfer plug to the heat sink.

In an embodiment a carrier arrangement includes a connection carrier and an insert body, wherein the connection carrier has at least one recess, wherein the insert body has a trench, which is arranged on a cover surface of the insert body, wherein the insert body is arranged in the recess of the connection carrier, wherein the trench does not completely penetrate the insert body in a vertical direction, and wherein the insert body does not extend completely through the connection carrier in the vertical direction.

An apparatus for providing a safety and EMC compliant heat sink. The apparatus includes a heat sink configured to be attached to an internal power plane of a printed circuit board (PCB). The heat sink includes a plurality of fins extending outward from the heat sink. The apparatus further includes a compliance cage configured to be connected to a ground portion of the PCB, the compliance cage surrounding at least a portion of the heat sink. At least one capacitor plate contacting at least a portion of the compliance cage and extending inwards towards the heat sink and interleaving with the plurality of fins is present. Dielectric spacers are provided to fill a portion of the space between the capacitor plates and the heat sink fins.

A circuit board includes a first external wiring layer, a second external wiring layer, a first internal structure, and a second internal structure. The first internal structure and the second internal structure are disposed between the first external wiring layer and the second external wiring layer. The first internal structure includes a first metal block extending from the first external wiring layer to the second internal structure. The second internal structure includes a second metal block, a high-frequency substrate, and a first conductive material. The second metal block penetrates through the high-frequency substrate. The first conductive material is disposed on the first metal block, in which the second metal block extends from the second external wiring layer to the first conductive material, and the first conductive material electrically connects the first metal block and the second metal block.

A circuit board includes a circuit base, an electronic component and a heat dissipation block. The circuit base has first and second surfaces, and a groove recessed from the second surface toward the first surface and has first and second side walls, and a bottom part adjacent to the first surface, where the width of the bottom part is smaller than the distance between the first and the second side walls. The circuit base includes first connection wiring and second connection wirings disposed on the first and the second side walls, first and second pads disposed on the bottom part and electrically connected to the first and the second connection wirings. The electronic component is disposed in the groove and is electrically connected to the first and the second connection wirings. The heat dissipation block is disposed in the groove and is thermally coupled to the electronic component.