A semiconductor device includes a substrate main body having a first surface and a second surface, an electric component arranged in the substrate main body, a first internal conductor pattern arranged in a first circuit layer located between the first surface and the electric component, and at least one heat absorbing member. The at least one heat absorbing member is arranged inside the substrate main body and thermally connected to the first internal conductor pattern.

A semiconductor storage device has a substrate, a semiconductor chip, a capacitor, and a heatsink. The semiconductor chip is mounted on the substrate. The capacitor is mounted on the substrate and overlaps with the semiconductor chip in a thickness direction of the substrate. The heatsink has fins and the capacitor is mounted in the heatsink.

An integrated circuit assembly comprises an integrated circuit die and a substrate coupled to the integrated circuit die on a first mounting surface of the substrate. A printed circuit board has a hole formed therein, and is connected to the substrate connected on a second mounting surface of the substrate. A vertically integrated voltage regulator assembly comprises one or more inductors and one or more voltage regulation circuits, and is connected to the substrate at a physical location on a second mounting surface of the substrate opposite the first mounting surface of the substrate. At least a portion of the vertically integrated voltage regulator assembly and at least a portion of the substrate are intersected by an axis normal to and through the first and second mounting surfaces of the substrate, and the vertically integrated voltage regulator is disposed at least partially within the hole in the printed circuit board.

A method of manufacturing a circuit board is provided. The method includes forming an open substrate, in which the open substrate includes a substrate body having a top surface and a bottom surface; an opening in the substrate body, in which the opening has a first sidewall and a second sidewall opposite to the first sidewall; and at least one first fixing portion and at least one second fixing portion extending from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. A heat dissipation block is inserted in the opening to clamp the heat dissipation block between the first fixing portion and the second fixing portion, in which the heat dissipation block includes the heat dissipation block comprises a ceramic or a composite material.

A circuit board includes a first external wiring layer, a second external wiring layer, a first internal structure, and a second internal structure. The first internal structure and the second internal structure are disposed between the first external wiring layer and the second external wiring layer. The first internal structure includes a first metal block extending from the first external wiring layer to the second internal structure. The second internal structure includes a second metal block, a high-frequency substrate, and a first conductive material. The second metal block penetrates through the high-frequency substrate. The first conductive material is disposed on the first metal block, in which the second metal block extends from the second external wiring layer to the first conductive material, and the first conductive material electrically connects the first metal block and the second metal block.

A component carrier includes: i) a first layer stack (comprising at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, where a main surface of the component is essentially flush with an outer main surface of the first layer stack iii) a second layer stack comprising at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and iv) a thermally conductive block embedded in the second layer stack. The layer stacks are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK, in particular at least 40 W/mK. Further, a method of manufacturing the component carrier is described.

A computing device includes a printed circuit board (PCB) having a ground plane and a power plane. The ground plane has a length L1 that extends between a first ground edge and a second ground edge. The power plane has a length L2 that extends between a first power edge and a second power edge. The ground plane is parallel to and separated from the power plane by a distance H. The computing device further includes a heat sink integrated with the PCB. The heat sink is parallel to and coupled to the power plane. The heat sink has a length L3 that extends between a first sink edge and a second sink edge. The length L3 of the heat sink is greater than at least one of the length L1 of the ground plane or the length L2 of the power plane.

The present disclosure relates to a printed circuit board comprising a glass layer with a first surface and a second surface opposing each other in a first direction. A heat dissipation member is embedded in the glass layer, and a through-via extends through at least a portion of the glass layer between the first and second surfaces. The heat dissipation member may be spaced apart from one or both surfaces of the glass layer.

This electronic device comprises: a substrate including a hole; an electronic component disposed on one surface of the substrate; a heat emitting body disposed on the other surface of the substrate; and a heat transfer member disposed between the electronic component and the heat emitting body, wherein the hole includes a first region into which a portion of the heat transfer member is inserted and a second region having a smaller width than the first region.