A PCB assembly includes a second PCB disposed adjacent to a first PCB and have a second hole facing a first hole, an upper plate disposed at an upper of the first and second hole and have a third hole disposed at the upper of the first hole and a fourth hole disposed at the upper of the second hole, a holder disposed at a lower of the first and second hole and have a lower plate having a fifth hole disposed at the lower of the first hole and a sixth hole disposed at the lower of the second hole, a first fixing screw penetrating through the third first, and fifth hole, and a second fixing screw penetrating through the fourth, second and sixth hole, and the lower plate includes a protrusion penetrating through the second PCB coupling the first PCB and the second PCB.

A functional electronics unit for a high current component which is provided for electrical and mechanical connection to a circuit board or to another mechanical carrier substrate for a circuit grouping or circuit, with conductor tracks, conductive surface elements and/or other conductive regions and contacts, the functional electronics unit having electronic components which are designed to measure properties of the electric current flowing through the component or of an electric voltage applied to the component or to perform another electronic functionality, is characterized in that the functional electronics unit is retained on the high current component or on a common carrier. More particularly, the functional electronics unit can be integrated into the high current components and/or can be pushed onto the high current component in a modular fashion or can be fixed on the high current component.

A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

A surface mount technology (SMT) terminal header is described for providing an electrical connection to a first printed circuit board (PCB). The SMT terminal header includes multiple first electrically conductive connector elements each having a base configured for surface mount attachment to the first PCB, and an insulative housing having multiple cells and a fixation member configured to attach the housing to the first PCB. Each of the multiple cells is configured to at least partially house one of the multiple first electrically conductive connector elements. Each of the first electrically conductive connector elements includes a position assurance member configured to attach the first electrically conductive connector element to at least one of the multiple cells of the insulative housing.

A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.

A mounting structure for a heater element includes a heater element having a surface to be cooled, a board on which the heater element is mounted, a cooling member that cools the surface to be cooled of the heater element mounted on the board, and a supporting member temporarily fixed to the board, the supporting member temporarily fixing the heater element.

A high-frequency module (1) includes a component (3a) mounted on an upper surface (2a) of a substrate (2), a second sealing resin layer (4) stacked on the upper surface (2a) of the substrate (2), a component (3b) mounted on a lower surface (2b) of the substrate (2), a first sealing resin layer (5) stacked on the lower surface (2b) of the substrate (2), and a first terminal assembly (6) and a second terminal assembly (7) that are mounted on the lower surface (2b) of the substrate (2). The first terminal assembly (6) is mounted on a four-corner portion of the substrate (2) and includes a connection conductor (6a) thicker than a connection conductor (7a) of the second terminal assembly (7).

The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.

An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

Disclosed are an integrated packaged light engine and signal emitting and receiving method thereof. The light engine includes molded interconnection device in which ceramic substrate is embedded, laser chip, photodiode chip, optical driving chip, transimpedance amplifier chip, array lens module and optical fiber interface provided on the ceramic substrate; the signal transmitting method includes: S1, powering optical drive chip by external power supply; S2, transmitting external signal to optical drive chip, so that laser chip emits optical signal; S3, totally reflecting and then transmitting optical signal by array lens module. The signal receiving method includes: S1, optical signal entering optical fiber interface; S2, optical signal entering array lens module; S3, transmitting optical signal to photodiode chip by array lens module; S4, converting and then transmitting optical signal into electrical signal to transimpedance amplifier chip by photodiode chip; S5, transmitting electrical signal to external circuit by transimpedance amplifier chip.