The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.

A fixing structure for heat dissipation assembly includes a base and multiple female fastener holders. The base has at least one through bore axially extending through an upper and a lower surface thereof, as well as coupling holes located outside the through bore and respectively having an engaging element disposed therein. The female fastener holder has a lower side formed with coupling protrusions corresponding to the coupling holes. The coupling protrusion has a guiding groove radially provided thereon and having a lower and an upper end recess for engaging with the engaging element in the corresponding coupling hole. The engaging elements in the coupling holes are guided by the guiding grooves to move from the lower to the upper recesses when the female fastener holder is turned relative to the through bore and the coupling holes on the base, bringing the coupling protrusions to axially insert into the coupling holes.

The present invention relates to a base fastener which is disposed corresponding to a pair of arc holes on a base. The base fastener comprises a body. The body has a first side, a second side, and a throughhole. The throughhole penetrates through the first side and the second side. A first post and a second post protrude from the second side beside the throughhole. The first post, the second post, and the pair of arc holes are disposed correspondingly and rotatably connected to each other to be assembled with the base firmly.

A vehicle luminaire according to an embodiment includes: a socket; a first board which is provided in the socket and has a first wiring pattern formed on one surface; at least one light-emitting element which is electrically connected to the first wiring pattern; and a plurality of power-supply terminals which are provided in the socket and are electrically connected to the first wiring pattern. The first board includes a plurality of first hollows which open to a side surface of the first board, a surface on an installation side of the light-emitting element in the first board, and a surface on the side opposite to the installation side of the light-emitting element in the first board. Each of the plurality of first hollows is provided with the power-supply terminal.

Various technologies described herein pertain to collocating a signal processing device with a micromechanical scanning silicon mirror as part of an apparatus. The micromechanical scanning silicon mirror and the signal processing device are part of separate dies. According to various embodiments, the apparatus can include wire bonds directly between sensor contacts of the micromechanical scanning silicon mirror and the signal processing device; the signal processing device can be mounted on a printed circuit board or mounted on or adjacent to the micromechanical scanning silicon mirror. Pursuant to other embodiments, the signal processing device can be mounted on the micromechanical scanning silicon mirror (e.g., mounted on a foot) and electrically coupled to sensor contacts of the micromechanical scanning silicon mirror (e.g., via wire bonds between the sensor contacts and the signal processing device or connectors that both mechanically and electrically connect the micromechanical scanning silicon mirror and the signal processing device).

An ECU, a control box, and a CMF using the ECU are provided. The control box includes a heat sink and the ECU. The ECU include a support bracket mounted on the heat sink, a power supply board supported by the support bracket, and a signal board stacked over the power supply board and electrically connecting with the power supply board. The support bracket is made of an insulation material. The power supply board carries a plurality of power devices which are in contact with the heat sink for heat dissipation multiple power devices.

A bridge array for connecting electronic components within a housing includes an array bracket and a plurality of connection modules coupled to the array bracket. Each connection module includes a first electrical connector configured to receive a first electronic component, and a second electrical connector configured to receive a second electronic component; thereby physically and electrically connecting the first electronic component and the second electronic component of each connection module. The array bracket includes a first electrical port electrically connected to the first electrical connector of each connection module. The first electrical port provides a common connection to the first electronic component of each connection module. The array bracket includes a second electrical port electrically connected to the second electrical connector of each connection module. The second electrical port provides a common connection to the second electronic component of each connection module.

An electrical connector includes an insulative housing retaining a plurality of contacts therein and surrounded by a metallic seat. A clip includes a frame with corresponding four walls to commonly form a receiving cavity to receive the electronic package therein, and each wall forms a pressing section to downwardly press an upward surface of the electronic package. A pair of latches are formed on a lower side of the frame to cooperate with the pressing sections of the walls to retain electronic package within the receiving cavity to be wholly a sub-assembly for being commonly received within the electrical connector. The clip includes a releasing handle to actuate the corresponding latch, and the releasing handle is positioned in an opening of the seat and intimately above the printed circuit board to function as a foolproof mechanism for loading the electronic package in a right orientation.

A semiconductor device is provided, in order to prevent tilt of a terminal pin in the semiconductor device with a printed board in which the terminal pin is pressed, the semiconductor device comprising a printed board, a plurality of pins pressed in the printed board, a resin block in which a plurality of through holes are formed, the plurality of pins respectively pressed in the plurality of through holes, and a resin case covering at least a part of the printed board and the resin block.

A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.