Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

A fourth layer outer frame protection pattern of a multilayer circuit board housed in a conductive base and a nonconductive cover is in contact with an inner surface of the base via a selection layer, and is connected to a second layer planar ground pattern via a coupling capacitor, outer peripheral portions of respective layer patterns including a first and third layer annular ground patterns are overlapped with each other, and the planar ground pattern is wire connected to a reference ground point of a vehicle body. When the base is conductively attached to the vehicle body, a selection layer is a solder resist film, and when it is non-conductively attached, the selection layer is a solder film, so that the planar ground pattern does not conduct with the base at the time of short circuit abnormality of the coupling capacitor.

Disclosed is an electronic device. The electronic device may include a printed circuit board (PCB) including at least one conducting wire, a first integrated circuit (IC) placed on the printed circuit board and including a transmit pin electrically connected to the at least one conducting wire, and a second IC placed on the printed circuit board and including a receive pin electrically connected to the at least one conducting wire, wherein the first IC is configured to transmit a specified signal having a first voltage through the transmit pin, and change an internal impedance of the first IC based on a reflected signal of the specified signal at a first time point.

A flexible type electrical feed-through involves a flexible printed circuit (FPC) part constructed as a laminate structure of a base insulating layer, a conductor layer, and a cover insulating layer, where the FPC part is wrapped around a metal part, forming a connector assembly. Such a feed-through may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment. Multiple connector parts may be coupled to an inner side of the feed-through, to each mate with a respective flexible cable assembly electrically connected to a respective actuator of a multi-actuator hard disk drive. A floating board-to-board connector part may be coupled to the outer side of the feed-through, which in turn is electrically connected to a printed circuit board assembly of a hard disk drive, and which is able to tolerate connector mating misalignment.

Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.

Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers.

A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

A fourth layer outer frame protection pattern of a multilayer circuit board housed in a conductive base and a nonconductive cover is in contact with an inner surface of the base via a selection layer, and is connected to a second layer planar ground pattern via a coupling capacitor, outer peripheral portions of respective layer patterns including a first and third layer annular ground patterns are overlapped with each other, and the planar ground pattern is wire connected to a reference ground point of a vehicle body. When the base is conductively attached to the vehicle body, a selection layer is a solder resist film, and when it is non-conductively attached, the selection layer is a solder film, so that the planar ground pattern does not conduct with the base at the time of short circuit abnormality of the coupling capacitor.