Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.

A circuit board assembly includes a circuit board and a conductive plate. The circuit board includes a substrate and a conductive trace. The conductive trace is disposed on the substrate. The conductive plate is fastened in a first region of the circuit board, and a current-carrying capacity of the conductive plate is greater than that of the conductive trace. In the circuit board assembly, the conductive plate capable of carrying a relatively large operating current is provided to significantly improve a current-carrying capability of the circuit board assembly; and the conductive plate and the circuit board are manufactured separately, and then, the conductive plate is disposed in the first region of the circuit board, to implement a fastened connection between the conductive plate and the circuit board. Therefore, manufacturing costs and process difficulty are reduced, and low-cost and batch manufacturing is implemented.

A layered plate including a copper layer having a thickness of 5 m or less, and a resin layer provided on a surface of the copper layer, in which a water absorption rate of the resin layer is 1% or less after being left in an environment of 130 C. in temperature and 85% in relative humidity for 200 hours.

A printed-wiring board has a land group with which a terminal group of a semiconductor package has been joined, a first conductor pattern arranged in a mounting area where the semiconductor package is mounted and joined with a heat radiation plate of the semiconductor package, a second conductor pattern, at least a part of which is arranged on the outside of the mounting area, and a third conductor pattern which connects the first and second conductor patterns. The land group includes a first land adjacent to the third conductor pattern and a second land which is not adjacent to the third conductor pattern, and the first land is formed in a shape different from that of the second land so as to be away from the third conductor pattern.

A metal pad interface configured to be soldered to an electrically conductive object to provide reliable electrical connection between the electrically configuration object and another electrically conductive object. The metal pad interface includes: a body including a core formed of copper or a copper alloy and a nickel-plating layer formed on an entire surface of the core; an upper contact portion formed on an upper surface of the body by plating the upper surface of the body with gold or a gold alloy; and a lower contact portion formed on a lower surface of the body by plating the lower surface of the body with gold or a gold alloy, wherein the lower contact portion is mounted on a divided land pattern of a circuit board by soldering to cover the divided land pattern, and an electrically conductive external object is electrically connected to the upper contact portion by bringing the object into contact with the upper contact portion.

An electronic-device having an intermediate connection layer interposed between a wiring substrate and an electronic component. The intermediate connection layer has a laminated structure including a rigid substrate and a flexible substrate. A first conductor part is formed on one principal surface of the flexible substrate, and second and third conductor parts are formed on both principal surfaces of the rigid substrate, respectively. The rigid substrate includes an opening, and the first conductor part of the flexible substrate includes a narrowed fuse part at a position opposite the opening. Windows are formed near the fuse part. The flexible substrate and the rigid substrate are electrically connected with each other via solder.

A power electronic module (10) for integration into a printed circuit board (50), comprising a carrier substrate (12) and a power electronic component (16) fitted into a recess (14) provided for this purpose in the carrier substrate (12), wherein the carrier substrate (12) is formed as a heat sink or heat dissipation body composed of one or more materials of high thermal conductivity at least in a region below the power electronic component (16).

A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module. A method of making a component-on-package circuit may include attaching a component for an electrical circuit to a circuit module. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides a spring-like cushioning of force applied to the component in the direction of the circuit module. The circuit module may be encapsulated in molding material after the circuit module has been attached to the component, without encapsulation the component at the same time.

A circuit board having a circuit pattern on a base plate and an additional metal layer laid and bonded on the circuit pattern, wherein the additional metal layer comprises an attachment plane portion configured to fix a semiconductor chip using solder, and an engagement uneven portion provided adjacent to the attachment plane portion, wherein the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.

Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.