Embodiments of the invention provides an IC system in which low-power chips can be positioned vertically proximate high-power chips without suffering the effects of overheating. In one embodiment, the IC system includes a first substrate, a high-power chip disposed on a first side of the first substrate, a thermal conductive pad disposed on a second side of the first substrate, one or more thermal conductive features formed in the first substrate, wherein the thermal conductive features thermally connect the high-power chip and the thermal conductive pad, and a heat sink attached to a surface of the thermal conductive pad, wherein the heat sink is in thermal communication with the thermal conductive pad. By having thermal conductive features formed through the first substrate to thermally connect the high-power chip and the thermal conductive pad, heat generated by the high-power chip can be effectively dissipated into the heat sink.

A high current switch, in particular for a motor vehicle, having a first bus bar, a second bus bar in addition to a first semi-conductor switch that has a control connection and a first transmission connection as well as a second transmission connection. The first transmission connection is placed in direct contact with the first bus bar and the second transmission connection is placed in direct electric contact with the second bus bar.

The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.

A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.

A printed circuit board includes a main body of laminate structures, and a metal piece. The main body has a first opening and a second opening. The metal piece is held by the laminate structures of the main body. The metal piece has a first face and a second face opposite to the first face. The first opening and the second opening respectively extend to the first face and the second face of the metal piece. A semiconductor optical device can be mounted on the first face of the metal piece, in the first opening.

A method for manufacturing a capacitor built-in substrate includes: preparing a capacitor built-in core insulating film and laminating a respective buildup layer to each of opposed main surfaces of the capacitor built-in core insulating film. The capacitor built-in core insulating film includes a first and second metal layers, an insulating layer and a capacitor. The first and second metal layers are disposed so as to face each other with the insulating layer interposed therebetween. The capacitor is disposed so as to extend through the insulating layer with one capacitor electrode being electrically connected to the first metal layer and the other capacitor electrode being electrically connected to the second metal layer.

A land group with which a terminal group of a semiconductor package has been jointed, a conductor pattern which has been arranged in a mounting area where the semiconductor package was mounted and which has been jointed with a heat radiation plate of the semiconductor package, a conductor pattern at least a part of which has been arranged on the outside of the mounting area, and a conductor pattern which connects the conductor patterns are formed on a printed-wiring board. The land group includes a land adjacent to the conductor pattern and a land which is not adjacent to the conductor pattern. The land is formed in a shape different from that of the land so as to be away from the conductor pattern.

There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board includes: a core layer having a cavity provided therein; an electronic component included in the cavity; a conductive partition disposed on a side of the cavity; and insulating layers disposed on and below the core layer.

An electronic-device having an intermediate connection layer interposed between a wiring substrate and an electronic component. The intermediate connection layer has a laminated structure including a rigid substrate and a flexible substrate. A first conductor part is formed on one principal surface of the flexible substrate, and second and third conductor parts are formed on both principal surfaces of the rigid substrate, respectively. The rigid substrate includes an opening, and the first conductor part of the flexible substrate includes a narrowed fuse part at a position opposite the opening. Windows are formed near the fuse part. The flexible substrate and the rigid substrate are electrically connected with each other via solder.

A L-Bending PCB includes a straight portion and a bending portion connecting to the straight portion, the straight portion has a metal substrate bottom, an insulation layer, a conductive layer and a protective layer. The insulation layer is disposed on a partial surface of the metal substrate bottom, the conductive layer is disposed on the insulation layer and the protective layer is disposed on the conductive layer.