A high voltage power supply can be compact with shielded electronic components. The power supply can include multiple stages separated by circuit boards. Electronic components for each stage can be directly soldered to adjacent circuit boards. Traces can pass through and electrically couple electronic components on each side of the circuit board between them.

Disclosed is a radiofrequency (RF) module including a surface acoustic wave (SAW) device that includes a piezoelectric substrate, an interdigital transducer (IDT) electrode and an input/output electrode formed on one surface of the piezoelectric substrate, and a bump joined to the input/output electrode, a printed circuit board (PCB) that includes a terminal corresponding to the input/output electrode and on which the SAW device is mounted to join the bump to the terminal, a molding portion that covers the SAW device, and a dam portion that surrounds the IDT electrode, the input/output electrode, and the bump not to allow a molding material that forms the molding portion to penetrate a space in which the IDT electrode, the input/output electrode, and the bump are arranged.

A surface mountable, toroid magnetic device is provided, the device having a potting filling the central hole of the toroid. The potting extends axially beyond the base of the toroid to form a contact surface which, in use, contacts a mounting body for the device. Heat generated by the device flows by conduction through walls of the toroid defining the central hole into the potting and then through the contact surface into the mounting body.

An inductor includes a magnetic core, a first winding, a first electrically conductive standoff, and a second electrically conductive standoff. The magnetic core includes opposing first and second outer surfaces separated from each other in a first direction. The first winding has first and second ends, and the first winding is wound around at least a portion of the magnetic core. The first electrically conductive standoff is connected to the first end of the first winding, and the first electrically conductive standoff extends along the magnetic core in the first direction from the first outer surface to the second outer surface. The second electrically conductive standoff is connected to the second end of the first winding, and the second electrically conductive standoff extends along the magnetic core in the first direction from the first outer surface to the second outer surface.

A single board computer system radiation hardened for space flight includes a printed circuit board having a top side and bottom side; a reconfigurable field programmable gate array (FPGA) processor device disposed on the top side; a connector disposed on the top side; a plurality of peripheral components mounted on the bottom side; and wherein a size of the single board computer system is not greater than approximately 7 cm7 cm.

A low power voltage control circuit for use in space missions includes a switching device coupled between an input voltage and an output voltage. The switching device includes a control input coupled to an enable signal, wherein the control input is configured to selectively turn the output voltage on or off based at least in part on the enable signal. A current monitoring circuit is coupled to the output voltage and configured to produce a trip signal, wherein the trip signal is active when a load current flowing through the switching device is determined to exceed a predetermined threshold and is inactive otherwise. The power voltage control circuit is constructed of space qualified components.

The present invention relates to a ceramic substrate unit comprising: a ceramic substrate including a ceramic basic material and a circuit pattern formed on the ceramic basic material; an electrode pattern portion included in the circuit pattern on the ceramic substrate and connected to an electrode of a semiconductor chip mounted on the ceramic substrate; and a spacer bonded to the electrode pattern portion of the ceramic substrate by means of a bonding layer, wherein the spacer is made of a metal or alloy having electrical conductivity and thermal conductivity. According to the present invention, a power semiconductor chip can be mounted on a substrate in a form similar to flip-chip bonding, and thus the bonding strength of the bonding surface between a spacer and the substrate is increased to improve the reliability thereof.

Various embodiments may relate to a lens for an illuminating device and an illuminating device having a lens of the above mentioned type, wherein the lens includes a bottom plate and at least one optical part formed on the bottom plate, wherein the lens further includes at least two assembly parts that are position-fixedly formed on the bottom plate, and the assembly parts are configured to be respectively aligned with assembly positions on a circuit board of the illuminating device and configured to allow to be soldered to the circuit board.

An optical module connector includes a connector configured to be coupled to a package substrate, which is coupled to first solder coupled to a printed board, and to second solder coupled to the printed board, the connector being coupled to the second solder; and an optical-module substrate configured to be detachably coupled to the connector, wherein the connector configured to include a first surface to which the optical-module substrate is coupled, a second surface coupled to the package substrate, and a third surface coupled to the second solder, and wherein the first surface to which the optical-module substrate is coupled includes a fourth surface opposite the second surface and a fifth surface opposite the third surface coupled to the second solder, and wherein a first height from the second surface to the first surface is less than a second height from the third surface to the first surface.

An inductor includes a magnetic core, a first winding, a first electrically conductive standoff, and a second electrically conductive standoff. The magnetic core includes opposing first and second outer surfaces separated from each other in a first direction. The first winding has first and second ends, and the first winding is wound around at least a portion of the magnetic core. The first electrically conductive standoff is connected to the first end of the first winding, and the first electrically conductive standoff extends along the magnetic core in the first direction from the first outer surface to the second outer surface. The second electrically conductive standoff is connected to the second end of the first winding, and the second electrically conductive standoff extends along the magnetic core in the first direction from the first outer surface to the second outer surface.