An electronic device according to an embodiment of the disclosure may include: a first circuit board; a second circuit board with a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction and facing the first circuit board; a first electronic component disposed between the first circuit board and the second surface of the second circuit board, and disposed in a first area of the second circuit board; a second electronic component disposed in a second area of the second circuit board; a heat dissipation device comprising a thermally conductive material disposed on the first surface of the second circuit board; a first heat transfer member comprising a thermally conductive material configured to transfer heat from the first electronic component to the heat dissipation device; and a second heat transfer member comprising a thermally conductive material configured to transfer heat from the second electronic component to the first circuit board.

A bobbin provides secure attachment of a magnetic component to a printed circuit board. The circuit board includes a set of slotted apertures and a set of tubular apertures. The bobbin includes at least two pin rails and a plurality of standoffs proximate each pin rail. L-shaped pins are attached to one of the pin rails. Straight pins are attached to the other pin rail. The component further includes a core, and at least one winding. The L-shaped pins are shaped to pass through and slide within the set of slotted apertures. The L-shaped pins engage the bottom surface of the circuit board when the straight pins are inserted through the set of tubular apertures (i.e., in a secured position). In the secured position, the magnetic component is held in place against the top surface of the circuit board and provides a soldering area for mounting on the bottom surface.

An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component.

The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.

A circuit assembly, including: an integrated circuit (IC) with a plurality of connection pads; a ball grid array (BGA) including a plurality of solder balls arranged in an array, where plurality of solder balls are configured to connect the plurality of connections pads to a plurality of connections pads on a PCB; and a BGA spacer configured to fit among the plurality of solder balls, wherein the BGA spacer has a width based upon a height and spacing of the plurality of solder balls and a height based upon a height and spacing of the plurality of solder balls and a minimum distance between the IC and the PCB to prevent shorting of adjacent solder balls.

A device for orienting contact terminals on an electrical component such that they fit to a circuit board of an electric circuit is disclosed. In an embodiment the device includes a carrier element configured to receive the electrical component and a plurality of bending elements, wherein the carrier element has a plurality of holes, each hole penetrating the carrier element from an upper side to an underside, wherein a respective section of the bending elements is secured to the carrier element and a respective end of the bending elements projects into a respective hole of the carrier element, and wherein the bending elements are configured such that the respective end of the bending elements, upon insertion of a respective contact terminal of the electrical component into the respective hole from the upper side of the carrier element, is bent within the hole and clamps the respective contact terminal.

An electronic component includes: a first substrate; a second substrate that includes a functional element formed on a lower surface of the second substrate, the second substrate being mounted on the first substrate so that the functional element faces an upper surface of the first substrate across an air gap; and an insulating film that is located on the upper surface of the first substrate, overlaps with at least a part of the functional element in plan view, faces the functional element across the air gap, and has a film thickness that is more than half of a distance between a lower surface of the functional element and the upper surface of the first substrate.

A high-frequency module includes a wiring substrate and an antenna substrate disposed on an upper surface of the wiring substrate, an antenna is formed by a metal pattern on the antenna substrate, a non-conductive adhesive and a conductive adhesive are disposed between the wiring substrate and the antenna substrate, and a spacer is provided between the non-conductive adhesive and the conductive adhesive. Thus, by the spacer, it is possible to prevent contact between the non-conductive adhesive and the conductive adhesive and it is also possible to ensure a required height between the wiring substrate and the antenna substrate. In addition, it is possible to achieve connection between the wiring substrate and the antenna substrate by a simple structure.

A packaging structure and method for surface mount integrated circuits reduces electrochemical migration (ECM) problems by including one or more cleaning channels to effectively and efficiently remove flux residue that may otherwise remain lodged in gaps between the surface mount package and the printed circuit board. A cleaning channel may be formed along a bottom surface of the surface mount package (i.e., the surface facing the printed circuit board), or along a portion of a top surface of the printed circuit board. In either case, the inclusion of a cleaning channel enlarges the gap between the bottom surface of the surface mount package and the printed circuit board and creates a path for contaminants to be flushed out during a cleaning process.

An apparatus for mounting on a circuit board is provided. The apparatus may include a circuit board mount packaging and a battery. The circuit board mount packaging may include a cavity, a first internal lead, and a second internal lead. The first internal lead may be connect to a first external pin and the second internal lead may be connected to a second external pin. The battery may be disposed within the cavity of the circuit board mount packaging. The battery may comprise an anode and a cathode. The anode may be wire bond connected to the first internal lead and the cathode may be wire bond connected to the second internal lead.