Patent classifications
H05K2201/10583
POWER SUPPLY DEVICE AND METHOD FOR PRODUCING THE SAME
A power supply device that includes a plurality of electricity storage elements each including lead terminals; a conductive connector connected to the lead terminals; a circuit board including a conductive path; a conductive relay terminal electrically connected to the conductive path, the connector being disposed so as to be in contact with the relay terminal; and a resin holder configured to hold the plurality of electricity storage elements, wherein the holder includes an electricity storage element holder configured to hold the electricity storage elements, a connecting member holder configured to hold the connector, and a fitting groove into which the lead terminals can be fitted, and the connecting member holder is formed so as to traverse the fitting groove.
SURFACE MOUNT CONNECTOR AND METHOD OF FORMING A PRINTED CIRCUIT BOARD
A surface mount connector and method of forming a printed circuit board includes providing a printed circuit board having a first aperture extending there through, and receiving a surface mount connector at the printed circuit board, the surface mount connector having a connector body and a flange, the connector body received by and aligned with the first aperture.
Electronic device comprising surface-mount device type dipoles, and corresponding assembly method
A base substrate has a thickness between two faces. The base substrate includes at least one hole extending in a thickness of the base substrate perpendicular to one of the two face. At least one dipole of a surface-mount device type is housed in the at least one hole of the base substrate.
Clamp and display device including same
According to an embodiment of the present disclosure, since the electronic components are fixed on the PCB by the clamp, post processing, such as soldering or application of an adhesive, may be not needed. Also, since the PCB can be spaced from the adjacent configurations by the clamp, the efficient layout of the PCB is possible, resulting in an improvement of productivity of the PCB. In accordance with an aspect of the present disclosure, there is provided a clamp comprises a fixing part configured to surround at least one part of the outer surface of an electronic component, a connection part extending from the fixing part, and penetrating a Printed Circuit Board (PCB), an interference part provided in at least one of the fixing part or the connection part, and configured to be interfered by the PCB and a spacing part protruding from at least one of the connection part or the fixing part.
Method of manufacturing a signal transition component having a C-shaped conducting frame
The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) miming through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.
Electrical device having improved surface mounting electrodes
In some embodiments, an electrical device can include a body having a shape that extends along a longitudinal direction, and a set of electrodes implemented on the body at different locations along the longitudinal direction and configured to allow the electrical device to be positioned and mounted to a surface. The set of electrodes can include first and second electrodes configured to provide first and second engagements with the surface, respectively, and to allow a settling motion when the electrical device is positioned on the surface. The set of electrodes can further include a selected electrode having a side configured to allow the settling motion and an engagement portion configured to stop the settling motion and thereby provide a third engagement with the surface.
METAL ELECTRODE LEADLESS FACE (MELF) DEVICE CRADLE
A cradle for a metal electrode leadless face (MELF) device is provided. The cradle can include at least one pad, such as a solder pad, to be connected to a printed circuit board (PCB) or similar board. The pad can be configured to receive a MELF device. Such a configuration can improve positioning and alignment of the MELF device and prevent or reduce movement of the MELF device prior to or during soldering. The pad can include boundaries to engage the MELF device for alignment and to prevent or reduce movement. The boundaries of the pad can include inlets, extensions, troughs, borders, and/or other features to engage the MELF device. Boards including such cradles are also provided. Further, methods of installing a MELF device on a board using a cradle are also provided.
ELECTRICAL SOCKET
A female electrical socket for receiving an electrical pin and for connection to a PCB is provided. The socket provides a body having a first end and a second end, each having an opening, wherein either opening is configured to receive a male electrical pin to form a connection with the female socket, and wherein the body has a central longitudinal axis. The socket further provides a plurality of contact fingers on the body, wherein a first end of each of the fingers is attached to the body and a second end of each of the fingers is radially directed inwards relative to the first end towards the central longitudinal axis to provide a retention force to engage with the electrical pin. At least one wing extends outwardly from the first end of the body. A corresponding method of manufacturing the socket is also provided.
WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR
A wire structure includes a metal layer, a dielectric layer covering at least a portion of an outer surface of the metal layer, and a filling material provided in the dielectric layer, wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer.
EXPLOSION-PROOF APPARATUS
An explosion-proof apparatus includes a stopper having a hollow cylindrical shape that is open at a first side and closed at a second side, and configured to be combined with an electrolytic condenser to surround an explosion-proof face of the electrolytic condenser and a lateral side connected to the explosion-proof face, through the first side, and a holder provided on the stopper to support the stopper. The first side of the stopper is separated from the explosion-proof face of the electrolytic condenser, a lateral side of the stopper has a stepped structure in which a periphery of a first region connecting to the first side is larger than a periphery of a second region connecting to the second side, and the holder is mounted on the stopper to surround at least part of the periphery of the second region of the stopper.