A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.

A connector comprising a frame having a circular shape and a first surface, a plurality of clips attached to the first surface, each clip comprising having a first tang and a second tang, the first tang and second tang biased toward each other, the first tang and the second tang describing a receiving cavity therebetween, and the receiving cavity for receiving a conductor.

An object is to, for physical properties, holding force, contact area, and insertion force in a trade-off relationship, set the holding force to 37 N or more, the contact area to 0.72 mm2 or more, and the insertion force to 90 N or less. A press-fit terminal is to be press-fitted into a through hole formed in a circuit board. A press-fit part includes a beam and an eye hole that is surrounded by the beam. The beam includes two parallel parts that are parallel to each other. In the press-fit part, G1/G2 is 0.20 or more and 1.05 or less where a front-side spring strength is G1 [mm3] and a rear-side spring strength is G2 [mm3] calculated under the following conditions, and G is 0.007 mm3 or more and 0.012 mm3 or less where a spring strength G [mm3] is G1+G2.

A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.

A printed circuit board includes a substrate having a plurality of stacked circuit board layers. The substrate has a top surface and a bottom surface. The printed circuit board includes a signal contact on the substrate. The signal contact has a signal via and a signal trace extending from the signal via. The signal via extends between the top surface and the bottom surface along a via axis. The printed circuit board includes an anti-pad around the signal via extending through the substrate along the via axis. The anti-pad extends between the top surface and the bottom surface. The anti-pad has a first width at the top surface and the lower anti-pad has a second width at the bottom surface different than the first width.

A printed circuit board (PCB) device including one or more insulating layers and one or more conducting layers arranged to form a layer stack; and one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack. Each of the one or more blind holes along the side edge of the layer stack is configured to receive a pin. Each pin can make an electrical connection with a corresponding blind hole.

A pin has a compliant section at a first end and a welding section at a second end opposite the first end. The compliant section is electrically connected with a via of a printed circuit board. The welding section has a welded connection with a passive component.

A float connector for interconnecting printed circuit boards that has a contact assembly including a contacts and a holder and each of the contacts has opposite first and second contact ends for electrically connecting to the boards. A first guide member is slidably and flexibly coupled to the contact assembly and has openings corresponding to the first contact ends. A second guide member is slidably and flexibly coupled to the contact assembly and has openings corresponding to the second contact ends. A biasing member biases the guide members away from one another to an open position. Axial float of the contact assembly is provided between the first and second guide members to compensate for axial misalignment between the first and second printed circuit boards. Radial float of the contact assembly is provided between the first and second guide members to compensate for radial misalignment between the boards.

Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

A printed circuit board includes a substrate having a plurality of stacked circuit board layers. The substrate has a top surface and a bottom surface. The printed circuit board includes a signal contact on the substrate. The signal contact has a signal via and a signal trace extending from the signal via. The signal via extends between the top surface and the bottom surface along a via axis. The printed circuit board includes an anti-pad around the signal via extending through the substrate along the via axis. The anti-pad extends between the top surface and the bottom surface. The anti-pad has a first width at the top surface and the lower anti-pad has a second width at the bottom surface different than the first width.