It is aimed to provide a press-fit terminal connection structure in which a board connecting portion of a press-fit terminal is press-fit into a through hole provided in a printed circuit board and which can combine the suppression of scraping of a surface layer and a reduction of a necessary load when the press-fit terminal is inserted into and withdrawn from the through hole and an improvement of a holding force for keeping the press-fit terminal inserted in the through hole. In the press-fit terminal connection structure, the press-fit terminal includes, at least on a surface of the contact point portion, an alloy containing layer mainly containing tin and palladium, and the through hole includes a tin layer on an outermost surface of an inner peripheral surface including at least the contact point portion.

The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.

In a control unit having a press-fit structure, a substrate includes: a connected portion to which the press-fit terminal is connected; and a guide portion extending from the substrate around the connected portion. The press-fit terminal includes: a tip end portion; a contact portion adjacent to the tip end portion; and an enlarged portion. The guide portion includes: an opening portion; a guide hole extending from the opening portion to the substrate; a tapered surface formed on an inner side of the opening portion; and a reduced-hole portion formed continuous to the tapered surface. The tip end portion of the press-fit terminal is configured such that the contact portion is positioned with respect to the connected portion while the enlarged portion is guided by the tapered surface and an inner wall of the reduced-hole portion.

Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board (PCB) that includes a set of vias through the PCB. The apparatus also includes a first small format pluggable (SFP) module coupled to a first surface of the PCB. The first SFP module includes a first set of pins configured to interface with a first subset of the set of vias. The first set of pins has a first pin layout. The apparatus further includes a second SFP module coupled to a second surface of the PCB. The second SFP module includes a second set of pins configured to interface with a second subset of the set of vias. The second set of pins has a second pin layout. A first pin of the first set of pins interfaces with a first via. A second pin of the second set of pins interfaces with the first via. The first subset and the second subset include the first via.

A printed circuit board including at least one blind metal-plated hole, for receiving a pin of the printed circuit board being covered by a first layer of a protective film on which there extends a second layer of electrically insulating flexible material, the first layer and second layer are for piercing by the pins when they are engaged in the metal-plated holes, the first and second layers being for claming between a support of the pins and the printed circuit board. An electronic unit including such a device. A method of fabricating a printed circuit card for such a device.

An electronic module includes a printed circuit board (PCB) element, a base with a first electrically conductive contact element, and an electronic component with a second electrically conductive contact element. The base is fastened on and electrically connected to the PCB element. The electronic component is electrically connected to the base by an electric contact region between the first and second contact elements. A first portion of the first contact element protrudes from the base on a first side of the base facing away from the PCB element. The first portion of the first contact element and/or a second portion of the second contact element has a resilient configuration such that the electronic component is mechanically fastened to the base by a spring force between the first and second contact elements. The electronic module in one embodiment is configured for a transmission controller or an electric vehicle

In a control unit including a press-fit terminal, a substrate includes: a connected portion into which the press-fit terminal is connected; and a guide member, which surrounds a periphery of the connected portion and extends from the substrate. The press-fit terminal includes: a connecting portion formed on a tip end side of the press-fit terminal; and an enlarged portion formed adjacent to the connecting portion. The guide member includes: an opening portion, which opens in a direction in which the press-fit terminal is positioned; a guide hole extending from the opening portion to the substrate; and a reduced-hole portion formed adjacent to the opening portion. The guide hole is configured such that, when the connecting portion of the press-fit terminal is connected to the connected portion of the substrate, the enlarged portion of the press-fit terminal closes the reduced-hole portion of the guide hole.

An insulation displacement terminal comprises a first portion, a second portion, and a press-fit pin. The first portion may comprise a first beam and a second beam. A slot is generally formed by a first central edge of the first beam and a second central edge of the second beam. The second portion may comprise a third beam, a fourth beam, and a fifth beam. The fourth beam is configured as a cantilever beam with an attached lower end and a distal end that is able to move between the third beam and the fifth beam. The press-fit pin is generally attached to an edge of the distal end of the fourth beam.

A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.