An electrical connection module for an automotive vehicle includes a printed circuit board with a retainer portion and an edge connector configured to be connected to the printed circuit board. The retainer portion includes an electric connection located in a recess of the printed circuit board, and the edge connector includes jaws intended to be coupled with the electric connection when entering the recess. The edge connector further includes a back portion from which the electric arm and the support arm protrude. The retainer portion includes two retaining arms, each retaining arm protruding from the printed circuit board towards the electric connection in a protruding direction which forms between 5 and 40 degrees with respect to the connection direction and leaving a space between them which is smaller than the width of the back portion of the edge connector.

A circuit board assembly includes a circuit board and a conductive plate. The circuit board includes a substrate and a conductive trace. The conductive trace is disposed on the substrate. The conductive plate is fastened in a first region of the circuit board, and a current-carrying capacity of the conductive plate is greater than that of the conductive trace. In the circuit board assembly, the conductive plate capable of carrying a relatively large operating current is provided to significantly improve a current-carrying capability of the circuit board assembly; and the conductive plate and the circuit board are manufactured separately, and then, the conductive plate is disposed in the first region of the circuit board, to implement a fastened connection between the conductive plate and the circuit board. Therefore, manufacturing costs and process difficulty are reduced, and low-cost and batch manufacturing is implemented.

A printed circuit board comprises a substrate as well as resistors and electrical connections disposed on the substrate. The substrate couples to a video graphics array connector that has pins, including video pins and return pins. A video pin transmits a video signal, and a return pin provides a ground for a corresponding video pin. The substrate has openings, where each opening can receive a pin. The resistors and the electrical connections couple to a subset of the pins to mimic an external video graphics array monitor. The resistors comprise: a red connection resistor that can couple a red video pin with a red return pin; a green connection resistor that can couple a green video pin with a green return pin; and a blue connection resistor that can couple a blue video pin with a blue return pin.

Printed circuit board assemblies (PCBAs) are a fundamental component used in nearly all electronics. PCBAs provide electrical connections and mechanical support to electronic components and are generally made of copper layers laminated onto, though, and/or between one or more non-conductive substrate layers. Press-fit pin connections are often driven through the non-conductive substrate layers to connect power or ground across multiple conductive copper layers within a PCBA and/or connect electronic components on opposing sides of the substrate layer(s). Some new PCBA designs utilize fewer, but larger contact pins (e.g., power pins) in place of a greater number of smaller contact pins. With larger contact pin sizes, press-fit pin connections become more difficult to achieve with repeatable reliability in electrical connection without damaging surrounding features in a PCBA. The press-fitting assembly fixtures, contact pins, and methods described herein are capable of repeatable reliability and avoiding open and short failures.

A method of interconnecting first and second printed circuit boards using a float connector with a contact assembly that includes installing a first guide member onto the first printed circuit board with the float connector in an open non-compressed position, after installing the first guide member onto the first printed circuit board, installing a second guide member onto the second printed circuit board with the float connector in the open non-compressed position, and compressing the first and second printed circuit boards toward one another to move the float connector from the open non-compressed position to a compressed position until contact ends of the contact assembly of the float connector are exposed outside of the first and second guide members, respectively, thereby electrically connecting the contact ends to the first and second printed circuit boards, respectively, for electrical connection between the first and second printed circuit boards through the float connector.

Apparatus and method for providing an electromagnetic interference (EMI) shield for removable engagement with a printed circuit board (PCB). A shaped electrically conductive member has a substantially planar member portion with multiple lateral member edges. The sidewalls are disposed at respective lateral member edges and are substantially orthogonal to the substantially planar member portion. At least one of the sidewalls includes at least one first snap-fit latching feature to engage a respective complementary second snap-fit latching feature disposed at one or more of multiple peripheral portions of a PCB.

A connector assembly can be provided. A receptacle includes terminals that can be positioned in a card slot on a 0.60 mm pitch (or greater). A biasing element can be provided in the card slot to engage a mating paddle card. The receptacle can be configured to allow air to flow from a front face to a rear face, the air passing through a middle wall. A plug assembly can be provided that includes a conductive body and is configured to generate some amount of heat. The body can include a surface that has cooling grooves. The cooling grooves allow air flow over the plug assembly so that the plug assembly can be cooled directly.

A semiconductor device includes a printed circuit board in a peripheral portion of a housing portion of a case in which a laminated substrate is housed. A terminal block holding control terminals from which control signals are outputted to the printed circuit board is disposed over the printed circuit board. A gate electrode of a semiconductor chip and the printed circuit board are electrically connected by a wire.

A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

A method provides a circuit carrier arrangement that includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.