A work machine including a flow device for flowing molten solder from under a circuit board, and a backup pin for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, which are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.

A press-fit terminal includes a bar part and a deformation part provided at an end portion of the bar part. The deformation part includes a recess, a front boundary portion and a rear boundary portion. The recess is provided between a front end portion of the deformation part and the end portion of the bar part. The front boundary portion defines a boundary between the recess and a surface of the deformation part adjacent to the front end portion of the deformation part. The rear boundary portion defines a boundary between the recess and the surface of the deformation part adjacent to the end portion of the bar part.

The disclosure relates to a method for contacting a contact surface on a flexible circuit board with a metal contact outside the flexible circuit board, with the aid of a press-fit pin. An attachment piece having a sleeve for receiving the press-fit pin is a mechanically and electrically coupled to the flexible circuit board.

A connection assembly generally comprising a thick conductor piece including a receptacle with an inner wall and a thin conductor piece. The thin conductor piece has a protrusion for insertion into the receptacle. A press-fit element can be inserted into the receptacle with the protrusion arranged in the receptacle between the press-fit element and the thick conductor piece.

An electrical heating device may comprise a heating element and a control board. The heating element may be electroconductively connected to the control board via at least one electrical contact pin. The control board may include a contact arrangement comprising at least one contact bushing that penetrates the control board. The at least one contact pin may penetrate the control board through the at least one contact bushing (6) while being is electroconductively pressure-connected to the contact bushing. A length of the at least one contact bushing may be smaller than or equal to a thickness of the control board, and the contact bushing may be arranged completely inside the control board.

An actuation device has a motor with a motor shaft and with at least one motor contact and/or sensor contact. A circuit board with at least one electronic circuit is provided. The motor is electrically connected by an electric connection to the circuit board. The motor contact and/or sensor contact is a press-fit contact pressed into at least one contact of the circuit board to produce the electric connection.

A press-fit terminal is configured to exert a reaction force through elastic deformation on a through-hole and to be supported by the board, and includes two beams to be opposite to each other and to be elastically deformable. The two beams respectively have counter surfaces facing to each other. Each beam includes: a base material with a main surface and a side surface having one or more rounded corners formed in a curved surface with a contact zone in contact with the wall surface of the through-hole; and a plated film having a main portion on the main surface and an extension portion having an average thickness smaller than an average thickness of the main portion. The two beams have two or more of the rounded corners in total, and at least one of the rounded corners are provided with the extension portion.

An electrical contact assembly includes an electrically nonconductive base, a first electrical contact supported by the base and a second electrical contact supported by the base such that the first contact and the second contact are separated by a space. The first electrical contact is configured to engage a first external conductive circuit element and the a second electrical contact is configured to engage a second external conductive circuit element. The first contact and the second contact are configured such that a portion of the first contact and a portion of the second contact converge as the base moves in a first direction relative to the first and second external conductive circuit elements and diverge as the base moves in a second direction relative to the first and second external conductive circuit elements.

A semiconductor module includes: a circuit board on which a first semiconductor chip and a second semiconductor chip are mounted and includes a first through hole formed with a conductor foil therein; a press-fit terminal that is electrically connected to the conductor foil in the first through hole of the circuit board; and a second resin that is disposed on a surface side and a back surface side of the circuit board. Further, the press-fit terminal is provided with a pressure contact portion which is press-fitted into the first through hole and is electrically connected to the conductor foil in the first through hole, and the second resin on the surface side of the circuit board and the second resin on the back surface side of the circuit board are integrally formed via a second resin that is filled in the first through hole.

A semiconductor device includes a printed circuit board in a peripheral portion of a housing portion of a case in which a laminated substrate is housed. A terminal block holding control terminals from which control signals are outputted to the printed circuit board is disposed over the printed circuit board. A gate electrode of a semiconductor chip and the printed circuit board are electrically connected by a wire.