An optical modulator includes: a bottom substrate layer, having a first surface; a traveling-wave electrode, being disposed on the first surface of the bottom substrate layer and including a plurality of ground electrodes and a plurality of signal electrodes between the ground electrode; an optical waveguide disposed inside the bottom substrate layer; and a shield layer, including a substrate and a metal layer, the substrate covering at least a portion of the traveling-wave electrode and the metal layer being disposed on the surface of the substrate facing away from the traveling-wave electrode. Each of the ground electrodes is electrically connected to the metal layer to provide electromagnetic shielding for the signal electrodes between the ground electrodes.

A printed wiring board includes a substrate, a contact member arranged in contact with the substrate, and a wear resistant member fixed at least in an area on the substrate that comes in contact with the contact member, the wear resistant member having a wear resistance higher than that of the substrate.

A bi-directional optical sub assembly connecting structure which is disclosed includes a first connecting plate, a second connecting plate, a connector, a first circuit, and a second circuit. The first connecting plate includes a plurality of first contacts for electrically connecting to a first transmitting end. The second connecting plate connects with the first connecting plate and includes a plurality of second contacts for electrically connecting to a second transmitting end. The connector connects with the first connecting plate for electrically connecting to a printed circuit board. The first circuit is located on the first connecting plate and electrically connected to the plurality of first contacts and the connector. The second circuit is located on the first connecting plate and the second connecting plate and electrically connected to the plurality of second contacts and the connector.

A circuit module (301) includes a first substrate (201), a first module (101), a sealing resin portion (3), and a conductive material film (7). The first substrate (201) has a first principal surface (201a). The first module (101) is mounted on the first principal surface (201a). The sealing resin portion (3) is formed on the first principal surface (201a) and covers the first module (101). The conductive material film (7) covers a side of the sealing resin portion (3). The first module (101) includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film (7) on the side of the sealing resin portion (3).

A circuit module (101) includes a substrate (1) having a principal surface (1a), a first component (6) mounted on the principal surface (1a), and a sealing resin portion (3) that covers at least a side surface of the first component (6) while covering the principal surface (1a). The first component (6) includes an empty portion (6c) and a connection portion (6b) exposed to the empty portion (6c). The sealing resin portion (3) is arranged to avoid at least a part of a region that is included in an upper surface of the first component (6) and corresponds to the empty portion (6c).

A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

An electronic device includes a support wafer, an electronic chip and an encapsulating block for the electronic chip above the support wafer. The support wafer is provided with a first network of electrical connections and a second network of electrical connections formed solely by tracks. First electrical connection elements are interposed between first front electrical contacts of the electronic chip and rear electrical contacts of the first network. Second electrical connection elements are interposed between second front electrical contacts of the electronic chip and internal electrical contact zones of the tracks of the second network. The first network includes front external electrical contacts and the tracks exhibiting external electrical contact zones.

An electrical apparatus is provided with a power semiconductor module, at least one capacitor, a circuit carrier, and a first heat sink. The power semiconductor module and the circuit carrier are arranged on the first heat sink. The electrical apparatus comprises a second heat sink arranged on the power semiconductor module and connected to the first heat sink.

The objective of the present invention is to improve reliability in a solder connection portion between an electronic component and a wiring pattern. A pair of wiring patterns (31A and 31B) are formed on a circuit wiring board (30) with an insulation layer (37) therebetween. Each wiring pattern (31A and 31B) has a land (33a or 33b) and a wiring portion (34a or 34b) that is narrower than the land. By way of solder (42), a chip component (41) is soldered to the lands (33a and 33b). The x (width) direction center (Xa) of each connection portion (53) where a respective wiring portion (34a or 34b) is connected to a respective land (33a or 33b) is disposed at a position that is outside of both the region in which a region of predetermined width (Wc) of the chip component (41) extends in the x (longitudinal) direction, and the region in which a region of predetermined length (Lc) of the chip component (41) extends in a y (transverse) direction.

A flexible printed circuit board including an electronic component includes a flexible printed circuit board, an electronic component, a cover, and a restricting portion. The printed circuit board including an electrically conductive line. The electronic component is mounted on the flexible printed circuit board and joined to the electrically conductive line. The cover covers a joint between the electronic component and the electrically conductive line. The restricting portion is along an outer edge of the cover. The flexible printed circuit board includes a groove along the outer edge of the cover. The groove is defined by opposed groove side surfaces. One of the opposed groove side surfaces farther from the electronic component is defined as the restricting portion.