An electrical connector for electrically connecting a chip module to a circuit board includes a body, having a plurality of accommodating slots penetrating the body, where a slot wall of at least one of the accommodating slots protrudes inward to form a boss, and the boss has a stopping corner; and a plurality of conductive terminals, correspondingly accommodated in the accommodating slots. At least one of the conductive terminals has an inclined portion, formed by tapering one side of the conductive terminal, wherein the inclined portion is adjacent to the stopping corner, the inclined portion is not parallel to a top surface of the boss, and the inclined portion is at least partially located above the stopping corner and configured to limit the conductive terminal from moving downward.

Illustrative embodiments disclosed herein pertain to a capacitive coupler that is custom fabricated to provide shape conformability with a component under test. The shape conformability allows the capacitive coupler to provide a high level of capacitive coupling between an electrode in the capacitive coupler and a metal part contained in the component. The electrode in the capacitive coupler has one or more characteristics such as a shape and an orientation, that are defined by utilizing the metal part as a template during fabrication of the capacitive coupler. In one exemplary embodiment, the electrode in the capacitive coupler has a form factor that substantially matches a form factor of the metal part contained in the component. In another exemplary embodiment, the metal part is oriented at a non-orthogonal angle with respect to a major surface of a printed circuit board upon which the component is mounted.

An electrical connector for electrically connecting a chip module to a circuit board includes a body, having a plurality of accommodating slots penetrating the body, where a slot wall of at least one of the accommodating slots protrudes inward to form a boss, and the boss has a stopping corner; and a plurality of conductive terminals, correspondingly accommodated in the accommodating slots. At least one of the conductive terminals has an inclined portion, formed by tapering one side of the conductive terminal, wherein the inclined portion is adjacent to the stopping corner, the inclined portion is not parallel to a top surface of the boss, and the inclined portion is at least partially located above the stopping corner and configured to limit the conductive terminal from moving downward.

A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.

In one example in accordance with the present disclosure, a fluid ejection controller is described. The fluid ejection controller includes a firing board to pass control signals to a fluid ejection device to eject fluid from the fluid ejection device. A mount pivotally holds the firing board between a disengaged position where electrical pins of the firing board are not in contact with electrical pads of the fluid ejection device and an engaged position where the electrical pins are in contact with the electrical pads. The mount includes a slot to receive the fluid ejection device and at least one biasing spring to bias the firing board away from the fluid ejection device during insertion of the fluid ejection device. The fluid ejection controller also includes a handle coupled to a cam shaft to move the firing board between the disengaged position and the engaged position.

Systems and methods for fine pitch component placement on printed circuit boards are described. In one embodiment, a printed circuit board includes multiple vias and multiple of electrically conductive pads. The multiple vias include at least a first via and a second via. The multiple electrically conductive pads include a first pad and a second pad. The first pad and/or the second pad may include an electrically conductive material such as copper, silver, gold, or another conductive material. In some cases, the first pad and the second pad each have a reduced width portion positioned between and spaced apart from the first via and the second via.

The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10), which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region (31) with the first terminal face, the second terminal face has a contact bead (30), which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown (33) which is oriented to a bottom (17) of the displacement compartment and is raised relative to a level contact surface (32) of the second terminal face surrounding the contact region.

A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.

An interconnexion film includes a base layer made of an insulating polymeric material and including a first face and a second face; a plurality of first patterns projecting from the first face, formed of the insulating polymeric material and configured so that the interconnexion film constitutes a dry adhesive film; a metal element of solid metal including a body which extends through the base layer; and as an extension of the body, at least one second pattern projecting from the first face, having a different shape to the first patterns and, in a plane parallel to the first face, a constant or decreasing cross-section away from the first face.

A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.