A multilayer ceramic substrate includes: a plurality of ceramic layers 300a, 300b stacked together; a via hole 400a, 400b provided in each of the plurality of ceramic layers, the via holes of the plurality of ceramic layers being connected together in a layer stacking direction of the plurality of ceramic layers; a via wire 406a, 406b including an electrical conductor filled into each of the via holes; a first conductor 404a, 404b provided on an upper surface of at least one of the plurality of ceramic layers, the first conductor having an annular or partially annular shape surrounding the via wire; and a second conductor 403a, 403b including a first portion and a second portion, the first portion being located outside the first conductor on the upper surface of the at least one ceramic layer, the second portion overlying the first conductor, and an inner rim of the second portion being located outside an inner rim of the first conductor, wherein a thickness of the first conductor 404a, 404b is greater than a thickness of the second conductor 403a, 403b.

An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed.

A metal foil pattern layered body of the invention includes a base member; a metal foil including a metal pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

[Problem] Provided is a composite member which can contribute to simple formation and/or increased quality of fine wiring. [Solution] A composite member 100 according to one embodiment of the present invention includes a base material, an aliphatic polycarbonate-containing layer with multiple island-shaped portions arranged on the base material, and a metal ink, wherein at least a surface of the aliphatic polycarbonate-containing layer with multiple island-shaped portions has a contact angle of 50 or more between pure water and the surface when exposed to ultraviolet light including a wavelength of 180 nm or more and 370 nm or less for 15 minutes, and the metal ink is arranged on the base material at at least a portion of a region sandwiched by the precursor layers.

A polymer layering process that encapsulates and protects electronics components with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold that apply close-forming, encapsulating the polymer layers to the electronic components and precision assemblies. Polymer layer protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces, and external electromagnetic emissions. By altering the protect layer configuration, the protective layer can accommodate populated circuit board assembly with high heat generation component(s).

A multilayer ceramic substrate includes: a plurality of ceramic layers 300a, 300b stacked together; a via hole 400a, 400b provided in each of the plurality of ceramic layers, the via holes of the plurality of ceramic layers being connected together in a layer stacking direction of the plurality of ceramic layers; a via wire 406a, 406b including an electrical conductor filled into each of the via holes; a first conductor 404a, 404b provided on an upper surface of at least one of the plurality of ceramic layers, the first conductor having an annular or partially annular shape surrounding the via wire; and a second conductor 403a, 403b including a first portion and a second portion, the first portion being located outside the first conductor on the upper surface of the at least one ceramic layer, the second portion overlying the first conductor, and an inner rim of the second portion being located outside an inner rim of the first conductor, wherein a thickness of the first conductor 404a, 404b is greater than a thickness of the second conductor 403a, 403b.

A manufacturing method of a flexible transparent circuit includes preparing a circuit template. The method further includes using a flexible transparent polymer material to prepare a cured transparent carrier on the circuit template, wherein the cured transparent carrier has a groove circuit structure. The method includes coating a solution containing a conductive material in a groove of the cured transparent carrier. The method further includes forming a circuit with the high transparency and conductivity after the solvent is volatilized. The circuit are designed and manufactured according to the requirements, and the precision thereof is able to achieve the micron or nanometer level. The formed circuit is light. The circuit can be stretched, bended or twisted many times. The circuit has a good biological compatibility. The circuit manufactured by such method is expected to be applied in various fields such as smart contact lens, flexible transparent electron devices, electronic skins.

Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.

Multilayer articles that include electrical circuits are prepared by the adhesive transfer of electrical circuit elements to the surface of an adhesive. A number of different methodologies are used, with all of the methodologies including the use of simple layers of circuit-forming material on a releasing substrate and structuring to generate circuit elements which can be transferred to an adhesive surface. In some methodologies, a structured releasing substrate is used to selectively transfer circuit-forming material, either from protrusions on the releasing substrate or from depressions on the releasing substrate. In other methodologies, an unstructured releasing substrate is used and either embossed to form a structured releasing substrate or contacted with a structured adhesive layer to selectively transfer circuit-forming material.

A manufacturing method of a flexible transparent circuit includes preparing a circuit template. The method further includes using a flexible transparent polymer material to prepare a cured transparent carrier on the circuit template, wherein the cured transparent carrier has a groove circuit structure. The method includes coating a solution containing a conductive material in a groove of the cured transparent carrier. The method further includes forming a circuit with the high transparency and conductivity after the solvent is volatilized. The circuit are designed and manufactured according to the requirements, and the precision thereof is able to achieve the micron or nanometer level. The formed circuit is light. The circuit can be stretched, bended or twisted many times. The circuit has a good biological compatibility. The circuit manufactured by such method is expected to be applied in various fields such as smart contact lens, flexible transparent electron devices, electronic skins.