An apparatus and a method are disclosed for producing an electric terminal contact on a coated sheet, whose coating has at least one electric conductor path covered by an electrical insulation layer, in which apparatus and method a recess is produced extending through the insulation layer at least to the electrical conductor path and in this recess, an electrically conductive contact element is provided, one end of which is electrically connected to the conductor path and at the other end of which forms the electrical terminal contact. In order to increase the reproducibility, the proposal is made for the recess to be produced with the aid of a hollow needle, which is advanced in the direction toward the conductor path and which, as it is withdrawn from the recess, introduces an electrically conductive, viscous compound into this recess in order to produce the contact element.

An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed.

A printed circuit board, preferably for use in a fuel fill-level sensor and in a fuel fill-level measuring system, having conductor tracks formed on two sides of a ceramic substrate. The ceramic substrate has at least one metalized hole for through-contacting that connects the conductor tracks to one another. The hole of the sintered ceramic substrate is filled with a metal-containing sintering paste, which is introduced under pressure. In the fully sintered state, the paste enters into at least one integral bond with the ceramic substrate and completely fills the hole in so doing.

A printing screen for use through-plating a printed circuit board. The printing screen has at least one screen hole for filling a larger hole compared to a reference hole in a ceramic substrate. This printing screen has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

The present application provides an apparatus for automatically clearing away residual solder paste, comprising: a working platform for bearing a solder paste tub accommodating a solder paste nozzle, the solder paste nozzle having a solder paste nozzle mouth, the working platform having a solder paste through-hole for accommodating the solder paste nozzle mouth; and a gas channel disposed in the working platform, the gas channel comprising a gas inlet and a gas outlet, the gas inlet being configured to be in communication with a cleaning gas source, and the gas outlet being configured to blow gas towards the solder paste nozzle mouth accommodated in the solder paste through-hole, thereby cutting solder paste remaining at the solder paste nozzle mouth.

The present application provides an automatic solder paste addition apparatus and system for a solder paste printer, the apparatus comprising: a push rod, a pressure plate, a support plate, a movable plate and a working platform; the pressure plate moves up and down as the push rod moves up and down, the support plate is fixed in relation to movement of the push rod, an outer side of the movable plate is disposed on the support plate so as to be capable of sliding up and down, the pressure plate is disposed on an inner side of the movable plate so as to be capable of sliding up and down, and the working platform is fixed to the movable plate and used for bearing a solder paste tub, wherein a lower one-way locking mechanism is provided between the movable plate and the support plate, the lower one-way locking mechanism being configured to lock the movable plate when the movable plate is in the working position, so that the movable plate cannot move downward; and wherein an upper locking mechanism is provided between the movable plate and the pressure plate, the upper locking mechanism being configured so that the pressure plate can move relative to the movable plate when the movable plate is not moving, and can also move together with the movable plate when the movable plate is moving.

The present application provides an apparatus for preventing solder paste dripping, comprising: a working platform support apparatus; a working platform connected in a fixed manner to one end of the working platform support apparatus, the working platform being used to bear a solder paste tub comprising a housing, with a solder paste nozzle being accommodated in the housing, the solder paste nozzle being mounted on the working platform, so that the solder paste tub is borne in an inverted manner on the working platform by means of the solder paste nozzle, with the housing being capable of moving relative to the solder paste nozzle so as to extrude solder paste accommodated in the solder paste tub from the solder paste nozzle; and a holder, the holder being connected to the housing of the solder paste tub and located above the working platform, and the holder being slidably connected to the working platform support apparatus, so that the holder can move downward as the amount of solder paste in the solder paste tub decreases, to adjust the relative position of the solder paste nozzle and the housing.

Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser are disclosed. Initially, a dispenser is continuously moved through a constant motion trajectory connecting the plurality of dispense locations on the substrate. The electrical output signals generated by one or more of encoders of the dispenser are monitored as the dispenser is continuously moved through the constant motion trajectory. The dispenser is triggered at each of the plurality of dispense locations and droplets of the fluid material are jetted while continuously moving the dispenser. The spatial coordinates of each droplet of the fluid material on the substrate are measured and compared to expected landing coordinates for each droplet of the fluid material to generate a spatial error for each droplet of the fluid material. At least one dispense location is corrected and an updated constant motion trajectory is generated.