The present application discloses a fitting apparatus (100) for fitting a sealing member (110) onto a solder paste nozzle (230), the sealing member having a sealing member mounting hole (112), and the fitting apparatus comprising: a support plate (116); at least two first power sources (101, 102, 103, 104); at least two insertion members (121) and a second power source (105). By controlling the driving directions and driving sequence of multiple power sources, the fitting apparatus of the present application completes the work of expanding the sealing member mounting hole in a mechanical fashion; an operator then only needs to pass the base plate of the nozzle through the sealing member mounting hole in order to complete the fitting of the sealing member to the nozzle, so the operation is convenient and saves manpower.

A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

Various embodiments include a method for producing electronic assemblies. The method may include: applying a fluid printing medium in a structured manner using a printing device multiple times consecutively in a sequential series of individual printing steps; measuring a rheological property of the printing medium in an automated repeated series of individual measurement steps during or between the individual printing steps; executing a computer-implemented rheological model for the execution of the individual printing steps, using the repeatedly measured rheological property as a variable input parameter; determining a favorable value for a selected printing parameter with the rheological model based on the currently measured rheological property; and automatically setting the determined favorable value for the selected printing parameter.

A hand-made circuit board includes a substrate and a medium layer disposed on a surface of the substrate to form a pattern. The medium layer has a non-conductive zone configured with a plurality of electrical blocks. The electrical blocks are discontinuously distributed in the non-conductive zone, so that the electrical blocks on at least one cross-section of the non-conductive zone are not electrically connected. In addition, the medium layer has a conductive zone configured with a plurality of electrical blocks. The electrical blocks are continuously distributed in the conductive zone, so that the electrical blocks on at least one cross-section of the conductive zone are electrically connected.

An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

An electronic device includes a substrate, a plurality of flexible circuit boards, a plurality of ICs and an insulator. The flexible circuit boards are disposed on the substrate. In a top view of the electronic device, the flexible circuit boards are overlapped with an edge of the substrate. The ICs are disposed on the substrate. The insulator is disposed on the flexible circuit boards and contacted the ICs, wherein the insulator has a first side and a second side opposite to the first side and the first side is closer to the edge than the second side. Along a first direction perpendicular to an extension direction of the edge, a first minimum distance between the second side and one of the ICs is less than a second minimum distance between the second side and one of the flexible circuit boards.

A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.

A sheet-fed system designed to print multilayer PCBs is introduced. The system consists of four main blocks; a drilling station, a patterning station, a stacking/bonding station, and a sintering zone. The substrate PCB is shuttled between these various stations, to have vias drilled, to be attached to stacks of previously-processed layers, to be covered with conductive paths by means of the aforementioned ink, and to have the ink sintered under a controlled temperature and atmosphere. Patterning is accomplished by means of a novel two-step method involving both high-temperature conductive elements, low-temperature conductive elements, and flux. Two such compositions are successively applied and individually sintered to form a single conductive path; the second application serves to fill the porosities of the first layer. By this method, a highly-conductive trace is obtained without requiring high temperatures, which in turn allows use of common substrates including polymers.

A touch substrate manufactured by three-dimensional printing and a method for manufacturing the same are disclosed. The method for manufacturing the touch substrate works together with a three-dimensional printer. The three-dimensional printer includes a first nozzle, a second nozzle, and a light source. The method includes the steps of: jetting a photocuring material by the first nozzle and exposing the photocuring material to the light source to form a base layer; jetting a conductive material on the base layer by the second nozzle and exposing the conductive material to the light source to form a touch electrode layer; and jetting the photocuring material on the base layer and the touch electrode layer by the first nozzle and exposing the photocuring material to the light source to form a protective layer. The touch electrode layer is embedded between the base layer and the protective layer.

A conductive pattern formation method includes: a step of patterning a base member with an ink in which conductive particulates are distributed to form a pattern; a step of making a conductive developer act on the pattern; and a pressurization step of pressurizing the pattern.