A method is provided for detecting faults in a conductive circuitry. The method includes: printing the conductive circuitry on top of a substrate using a printing head; heating the conductive circuitry with a heat source; scanning the heated conductive circuitry with a non-contact thermal detector; detecting, with the non-contact thermal detector and concurrently with the printing of the conductive circuitry, the faults where the printing head failed to print; and reprinting the faults with the printing head.

Disclosed are a screen printer improved in solder separation and a method of controlling the same, in which close contact between a printed circuit board and a mask unit is enhanced to thereby improve the solder separation and stably supply a fixed quantity of solder supplied through a squeeze unit to the printed circuit board.

A soldering device includes a detection sensor which can detect a liquid level height of molten solder inside a solder bath. It is determined whether or not a detection height which is the detected liquid level height is greater than or equal to a first set height which is arbitrarily set. In a case where the detection height is greater than or equal to the first set height, it is estimated that the amount of molten solder capable of performing a soldering work for a predetermined number or more of boards is stored in the solder bath. The amount of molten solder stored in the solder bath is estimated by multiplying a difference between a detection height which is the detected liquid level height of the molten solder and a second set height which is preset, by an area inside the solder bath in a horizontal direction.

In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.

A contact-distance transformer of an electric testing device for testing an electric specimen such as a wafer, for reducing a distance between neighboring electric contacts, the transformer having a non-electrically conductive supporting structure with a first side with first electric contacts positioned apart a first distance and a second side with second electric contacts positioned apart a second, smaller distance. The first contacts are connected to the second contacts by electric connections passing through the support structure and/or which are positioned on the support structure.

A dispensing system includes an optional pre-heat station configured to receive an electronic substrate, a dispense station configured to dispense material on the electronic substrate received from the optional pre-heat station, an optional post-heat station configured to receive the electronic substrate from the dispense station, and a non-contact sensor positioned above the electronic substrate on at least one of the optional pre-heat station, the dispense station, and the optional post-heat station.

An electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.

A printed circuit board (PCB) comprises a blind via and a discrete component vertically embedded within the blind via.

A one-step react-on-demand (RoD) method for fabricating flexible circuits with ultra-low sheet resistance, enhanced safety and durability. With the special functionalized substrate, a real-time three-dimensional synthesize of silver plates in micro scale was triggered on-demand right beneath the tip in the water-swelled PVA coating, forming a three-dimensional metal-polymer (3DMP) hybrid structure of 7 m with one single stroke. The as-fabricated silver traces show an enhanced durability and ultralow sheet resistance down to 4 m/sq which is by far the lowest sheet resistance reported in literatures achieved by direct writing. Meanwhile, PVA seal small particles inside the film, adding additional safety to this technology. Since neither nanomaterials nor a harsh fabrication environment are required, the proposed method remains low-cost, user friendly and accessible to end-users. the RoD approach can be extended to various printing systems, offering a particle-free, sintering-free solution for high resolution, high speed production of flexible electronics.

A system and corresponding method for additive manufacturing of a three-dimensional (3D) object to improve packing density of a powder bed used in the manufacturing process. The system and corresponding method enable higher density packing of the powder. Such higher density packing leads to better mechanical interlocking of particles, leading to lower sintering temperatures and reduced deformation of the 3D object during sintering. An embodiment of the system comprises means for adjusting a volume of a powder metered onto a top surface of the powder bed to produce an adjusted metered volume and means for spreading the adjusted metered volume to produce a smooth volume for forming a smooth layer of the powder with controlled packing density across the top surface of the powder bed. The controlled packing density enables uniform shrinkage, without warping, of the 3D object during sintering to produce higher quality 3D printed objects.