There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.

A dispensing system includes a dispensing unit assembly configured to dispense viscous material and a gantry coupled to the frame. The gantry is configured to support the dispensing unit assembly and to move the dispensing unit assembly in x-axis and y-axis directions. The dispensing unit assembly includes a support bracket secured to the gantry and a movable bracket rotatably coupled to the support bracket by a first strain wave gear system configured to enable the rotation of the movable bracket with respect to the support bracket about a first axis. The dispensing unit assembly further includes a dispensing unit rotatably coupled to the movable bracket by a second strain wave gear system configured to enable the rotation of the dispensing unit with respect to the movable bracket about a second axis generally perpendicular to the first axis.

A conductive tape formed by laying a conductive pathway on a tape layer is disclosed. Various apparatus and methods for laying conductive pathways to form conductive tape are disclosed. The conductive pathways may be laid by varying the lateral position of the conductive pathway on the tape substrate. Such patterns all stretchable conductive tape to be realized. Multiple conductive pathways may be laid in the tape and the lateral separation of the pathways in the tape may vary. In some embodiments the pathways are formed from conductive yarn or by printing or laying conductive ink.

A method of dispensing a metallic nanoparticle composition along a trajectory on a substrate is disclosed. The composition is dispensed from a nozzle through its outlet. The outlet is characterized by an outlet size. First, an initial pressure is applied to the composition in the nozzle to cause the composition to flow from the outlet. The nozzle is positioned at a height such that the composition does not flow onto the substrate. Second, the nozzle is lowered toward the substrate such that a fluid bridge forms between the outlet and the substrate and an adjusted pressure is applied to the composition in the nozzle. The adjusted pressure is lower than needed for the composition to continue to flow from the outlet. Third, the fluid is dispensed from the nozzle. A dispensing pressure is applied to the fluid while the nozzle is laterally displaced along the trajectory on the substrate.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit.

A method of applying viscous media on a substrate is disclosed. In the method, the substrate is provided, which is arranged for mounting of electronic components thereon. Further, flux is provided on a deposit of solder paste, which deposit is arranged at a predetermined position on the substrate. The flux is provided by a non-contact dispensing process, such as jetting. By providing flux on the deposit prior to reflow, the risk of quality related issues, such as e.g. graping, advantageously is reduced.

The present invention comprises a method of manufacturing electronics without PCBs and an apparatus for manufacturing electronics without PCBs.

The present disclosure provides a curved surface coating device. The curved surface coating device includes a bracket having a first and second ends. The curved surface coating device includes a glue coating portion connected with the first end of the bracket. The curved surface coating device includes a transmission member connected between the first and second ends of the bracket and its distance from the first end of the bracket is adjustable. The curved surface coating device includes a first driving mechanism connected with the transmission member for driving the bracket to rotate about the transmission member as a center of rotation. The curved surface coating device includes a second driving mechanism connected with the bracket for driving the bracket to move on a line where the first end and the second end are located.